Parallel-Plate Plasma Source With Insulating Heat Transfer Path
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in achieving uniform plasma processing due to heat-related warpage of electrodes, which affects the consistency of plasma generation and processing outcomes.
Innovation Solution
The apparatus incorporates a plasma processing apparatus with a heat transfer member made of an insulator, such as AlN, positioned between the parallel plate electrodes to effectively dissipate heat while maintaining insulation, thereby preventing electrode warpage and ensuring consistent plasma generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If radio-frequency power is supplied to generate plasma between parallel plate electrodes, then plasma processing capability is improved, but electrode warpage occurs due to heat accumulation
Solution Approach 1:
A heat transfer member (insulator with high thermal conductivity) is introduced as an intermediary between the upper and lower electrodes. This mediator conducts heat away from the electrodes while maintaining electrical insulation, thereby preventing electrode warpage caused by heat accumulation during high-power plasma generation
Solution Approach 2:
The harmful heat accumulated in the electrodes is extracted and removed through the heat transfer member. By providing a dedicated thermal conduction path separate from the electrical circuit, the harmful thermal energy is taken out of the electrode system, preventing shape deformation
2Productivity
If high radio-frequency power is used to enhance plasma generation, then plasma processing efficiency is improved, but plasma uniformity deteriorates due to electrode warpage
Solution Approach 1:
The heat transfer member acts as a thermal mediator that maintains electrode temperature stability during high-power operation. By continuously conducting heat away, it prevents the thermal distortion that would otherwise cause plasma non-uniformity, enabling sustained high-efficiency processing with consistent plasma quality
Solution Approach 2:
The introduction of the heat transfer member changes the thermal parameters of the electrode system by providing a controlled thermal conduction path. This parameter change allows the electrodes to operate at higher power levels while maintaining stable temperature and shape, thereby preserving plasma uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform plasma processing by maintaining a constant electrode interval, reducing plasma non-uniformity, and enhancing the stability and efficiency of plasma processing, even at higher radio-frequency power frequencies.
Implementation Method 1
a heat transfer member including an insulator, and provided between the first electrode and the second electrode so as to thermally connect these
Implementation Method 2
a radio-frequency power supply unit that forms a radio-frequency electric field between the first electrode and the second electrode
Implementation Method 3
plasma is generated by supplying radio-frequency power to an electrode
Data Source
AI summary
A plasma processing apparatus includes a processing container having a processing space where a substrate is disposed; a plasma generation unit including a first electrode and a second electrode which are provided facing each other and are configured as parallel plate electrodes, and having a plasma generating space formed between the first electrode and the second electrode; a radio-frequency power supply unit configured to form a radio-frequency electric field between the first electrode and the second electrode; a gas supply unit configured to supply a processing gas for plasma generation in the plasma generating space; a plasma introduction unit configured to introduce the plasma generated in the plasma generating space to the processing space; and a heat transfer member including an insulator and provided between the first electrode and the second electrode. Plasma processing is performed on the substrate by the plasma introduced to the processing space.