Plasma Source for Vacuum Pumping Line Self-Cleaning

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Solution Overview

Problem

In semiconductor processing, unwanted material deposition on valves and vacuum pumping lines leads to reduced valve lifespan, clogging, and contamination, requiring manual cleaning and downtime, while existing remote plasma sources are not targeted or automated enough to effectively address these issues.

Innovation Solution

A plasma source integrated with valves and vacuum pumping lines to generate localized plasmas, using a dielectric barrier discharge structure with an electrode and barrier dielectric, which can be activated to prevent and remove deposits, maintaining gaseous byproducts in a vapor state and etching away solid deposits without interfering with the pumping line's function.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual cleaning of valves and pumping lines is performed, then deposition is removed, but downtime increases and operational efficiency decreases

Engineering Contradiction:

Improvevalve cleanlinessVSAvoiddowntime

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The valve assembly performs self-cleaning through an integrated plasma generation system. The plasma source is built into the valve structure, allowing it to automatically clean deposits from its own surfaces without external intervention or system shutdown, thereby maintaining reliability while eliminating downtime.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The manual mechanical cleaning process is replaced with a plasma-based cleaning system. The plasma source generates reactive species that chemically remove deposits from valve surfaces, substituting the need for physical disassembly and manual cleaning operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If remote plasma sources are used for cleaning, then some cleaning effect is achieved, but cleaning precision and effectiveness are insufficient

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidcleaning system configuration

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The plasma cleaning system is merged with the valve assembly structure itself. The plasma source, electrodes, and valve components are integrated into a single unified device, eliminating the need for separate remote plasma sources and complex external cleaning configurations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The plasma generation is localized to specific areas within the valve assembly where deposits form. The plasma source is positioned to target critical surfaces directly, providing concentrated cleaning effect precisely where needed rather than diffuse remote cleaning.

Inventive Principle:

Principle #3Local quality

3Reliability

If valve cleaning is performed by disassembly, then thorough cleaning is possible, but operational time and system availability are reduced

Engineering Contradiction:

Improvevalve cleanlinessVSAvoidsystem availability

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The plasma cleaning operation can be performed continuously during normal valve operation or during brief intervals without requiring full system shutdown. This maintains continuous productivity while ensuring thorough cleaning of valve surfaces.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables automatic, targeted cleaning of valves and vacuum pumping lines, preventing future deposition and extending equipment lifespan, reducing downtime, and maintaining the precision of gas pressure control in semiconductor processing.

Implementation Method 1

A plasma source integrated with valves and vacuum pumping lines to generate localized plasmas

Methodology Applied

Scientific EffectPlasma: Plasma

Implementation Method 2

using a dielectric barrier discharge structure with an electrode and barrier dielectric

Methodology Applied

Scientific EffectDielectric barrier discharge:

Implementation Method 3

at least a portion of the barrier dielectric is located between the electrode and the electrically grounded surface

Methodology Applied

Scientific EffectDielectric barrier: Dielectric

Data Source

PatentEP4131331A1Plasma source and method for manufacturing said plasma source

Publication Date: 2023.02.08 MKS INSTR INC

Figure 1
Figure 2a~2c
Figure 3a~3b

AI summary

A vacuum pumping line plasma source is provided. The plasma source includes a body defining a generally cylindrical interior volume extending along a central longitudinal axis. The body has an input port for coupling to an input pumping line, an output port for coupling to an output pumping line, and an interior surface disposed about the generally cylindrical interior volume. The plasma source also includes a supply electrode disposed adjacent to a return electrode, and a barrier dielectric member, a least a portion of which is positioned between the supply electrode and the return electrode. The plasma source further includes a dielectric barrier discharge structure formed from the supply electrode, the return electrode, and the barrier dielectric member. The dielectric barrier discharge structure is adapted to generate a plasma in the generally cylindrical interior volume.