Plasma Spray Ceramic Coating for Particle Control

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Solution Overview

Problem

In the semiconductor industry, plasma etch and clean processes can lead to corrosion and particle contamination in processing chambers, which increases device defects as device geometries shrink, requiring more stringent particle contamination control.

Innovation Solution

A ceramic coating is applied using a plasma spraying system with specific parameters to create a dense, smooth surface with built-in compressive stress, comprising materials like Y2O3, Y4Al2O9, and solid-solutions with ZrO2, Al2O3, and other oxides, forming pancake-shaped splats in an amorphous phase to reduce porosity and cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional plasma spray coating is used, then coating can be applied to protect against plasma corrosion, but the coating contains porosity and cracking that generate particle contamination

Engineering Contradiction:
Improveplasma resistanceVSAvoidparticle contamination
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling plasma spray parameters (plasma power, substrate temperature, spray distance) to achieve specific coating microstructure. The substrate temperature is maintained at 50-150°C during spraying, and plasma power is controlled at 20-50 kW to produce a coating with controlled porosity (0.1-5%) and compressive stress, preventing particle generation while maintaining plasma resistance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by creating a coating with controlled combination of crystalline and amorphous phases. The coating contains 20-80 wt% crystalline phase (such as alumina, silica, or spinel) and 20-80 wt% amorphous phase, forming a composite structure that provides both plasma resistance and reduced particle contamination through controlled porosity and stress distribution

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If device geometries are shrunk to improve manufacturing precision, then device performance is enhanced, but susceptibility to particle contamination increases

Engineering Contradiction:
Improvedevice geometry controlVSAvoidparticle contamination sensitivity
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies this principle by creating a protective coating that can be applied and renewed on processing chamber components. The coating serves as a sacrificial protective layer that prevents particle generation from substrate corrosion, allowing the underlying precision components to remain protected and functional for extended periods

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If different chamber materials are used to improve plasma resistance, then material durability is enhanced, but material cost and other properties vary

Engineering Contradiction:
Improveplasma resistanceVSAvoidmaterial selection complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by developing a multi-functional plasma spray coating that simultaneously provides plasma resistance, erosion resistance, and controlled porosity to prevent particle generation. The coating can be applied to various substrates (metal, ceramic, polymer) and provides multiple protective functions, reducing the need to select from multiple different material options

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coating significantly reduces on-wafer particle contamination, enhances erosion resistance, and extends the useful lifetime of components by minimizing porosity and cracking, improving on-wafer defect performance and resistance to chemical attacks.

Implementation Method 1

performing a plasma spray process by the plasma spraying system to coat at least one surface of the body with a ceramic coating

Methodology Applied
Scientific EffectPlasma spray: Plasma Spray

Implementation Method 2

expose a substrate to a high-speed stream of plasma to etch or clean the substrate

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS11578398B2Plasma spray coating design using phase and stress control
Publication Date: 2023.02.14 APPLIED MATERIALS INC
  • US11578398B2 patent drawing
  • US11578398B2 patent drawing
  • US11578398B2 patent drawing

AI summary

An article includes a body having a plasma-sprayed ceramic coating on a surface thereof. The body can be formed of at one least one of the following materials: Al, Al2O3, AlN, Y2O3, YSZ, or SiC. The plasma-sprayed ceramic coating can include at least one of Y2O3, Y4Al2O9, Y3Al5O12 or a solid-solution of Y2O3 mixed with at least one of ZrO2, Al2O3, HfO2, Er2O3, Nd2O3, Nb2O5, CeO2, Sm2O3 or Yb2O3. The plasma-sprayed ceramic coating can further include splats.