Plasma Stage Cooling Layout for Heater Board Temperature Stability
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Solution Overview
Problem
Existing plasma processing apparatus stages face issues with instability and dew condensation due to temperature fluctuations and heat input from plasma, affecting the operation of the heater control board and devices within the accommodation space.
Innovation Solution
The stage incorporates coolant inlets and outlets on the base surface opposite the placement surface, combined with diffusion members and a heat shield plate, to effectively cool and stabilize the heater control board, preventing dew condensation and maintaining device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the heater control board is disposed in the accommodation space surrounded by the transmission path, then the structural integration is improved, but the temperature stability deteriorates due to heat input from plasma and plasma processing gas
Solution Approach 1:
A heat shield plate is introduced as an intermediary component between the plasma processing environment and the heater control board. The heat shield plate includes a cooling passage through which cooling gas flows, creating a thermal barrier that protects the heater control board from heat input while allowing the board to remain integrated in the accommodation space.
Solution Approach 2:
Cooling gas is introduced through the inlet into the cooling passage of the heat shield plate, using fluid flow to remove heat from the accommodation space. This pneumatic cooling system maintains temperature stability of the heater control board without requiring external cooling infrastructure.
2Volume of stationary object
If the heater control board is disposed in the accommodation space, then the space utilization is improved, but dew condensation occurs on the board due to temperature fluctuations
Solution Approach 1:
The heat shield plate acts as a protective intermediary between the cold heater control board and the warm plasma processing environment. By controlling the temperature gradient through the cooling passage, the heat shield plate prevents dew condensation from forming on the heater control board while maintaining space-efficient integration.
Solution Approach 2:
The temperature parameters in the accommodation space are actively controlled by adjusting the cooling gas flow through the heat shield plate. This parameter control prevents the temperature from dropping to the dew point, eliminating dew condensation while maintaining compact integration.
3Temperature
If cooling is provided to the accommodation space, then the temperature stability is improved, but the device complexity increases due to additional cooling components
Solution Approach 1:
The cooling function is merged with the heat shield plate structure itself. The heat shield plate incorporates cooling passages within its body, combining the thermal barrier function and the cooling system into a single integrated component. This reduces overall device complexity compared to having separate cooling apparatus while maintaining temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable operation of the heater control board by maintaining optimal temperature and preventing condensation, thereby enhancing the reliability and efficiency of plasma processing.
Implementation Method 1
the base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space
Implementation Method 2
combined with diffusion members and a heat shield plate, to effectively cool and stabilize the heater control board
Implementation Method 3
combined with diffusion members and a heat shield plate, to effectively cool and stabilize the heater control board, preventing dew condensation
Data Source
AI summary
A stage includes a base having an accommodation space therein, a dielectric layer provided on a first surface of the base and having a placement surface on which a substrate is placed, the dielectric layer including therein a plurality of heaters, and a heater control board disposed in the accommodation space and configured to drive the plurality of heaters. The base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space.