Multi-Stage Plasma Substrate Processing With Impedance Matching
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Solution Overview
Problem
Multi-stage substrate processing apparatuses experience impedance deviations due to structural and hardware complexities, leading to RF power coupling imbalances and process deviations during plasma processing.
Innovation Solution
An apparatus with an impedance matcher that calculates and compensates for impedance differences between stages using a sensor module, compensation value calculation module, and vacuum variable capacitors to ensure uniform power distribution across processing spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple stages are used to simultaneously process multiple substrates, then productivity is improved, but impedance deviation occurs between stages leading to process non-uniformity
Solution Approach 1:
The patent applies local quality by providing individual impedance matching circuits for each stage rather than a uniform approach. Each stage has its own impedance matching capability, allowing local adjustment to compensate for structural and hardware variations specific to each stage, thereby maintaining process uniformity while processing multiple substrates simultaneously.
Solution Approach 2:
The patent utilizes parameter changes by dynamically adjusting impedance parameters through variable capacitors in the impedance matching circuits. By changing capacitance values to match impedances across different stages, the system compensates for deviations caused by multi-stage configuration, ensuring uniform RF power distribution and consistent plasma processing conditions across all stages.
2Adaptability or versatility
If complex structural factors and hardware modules are used in multi-stage configuration, then processing capability is enhanced, but impedance deviation and RF power coupling imbalance occur
Solution Approach 1:
The patent implements feedback through impedance sensing and matching circuits that monitor and adjust impedance conditions for each stage. By continuously sensing impedance deviations and applying compensatory adjustments through variable capacitors, the system maintains reliable RF power balance despite the complexity of multi-stage configuration with multiple processing spaces and substrate supporters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces process deviations by matching impedances, allowing for uniform plasma processing of substrates and improving process uniformity and productivity.
Implementation Method 1
The impedance matcher may calculate impedances under the substrate supporter in regions with where the stages in simultaneously processing the substrates. The impedance matcher may compare the calculated impedances with a reference impedance to obtain an impedance compensation value.
Implementation Method 2
The vacuum variable capacitor module may change a capacitor value based on the impedance compensation value to identically match the impedances of the regions with the stages with each other.
Implementation Method 3
The RF power supply block may provide the processing spaces, for example, the showerheads with an RF power to form a plasma atmosphere in the processing spaces.
Data Source
AI summary
An apparatus for processing substrates may include a process chamber, a substrate supporter and an impedance matcher. The process chamber may process a plurality of the substrates using plasma. The process chamber may include a plurality of processing spaces configured to simultaneously process the substrates. The substrate supporter may be arranged in each of the processing spaces. The substrate supporter may include a plurality of stages configured to support the substrates. The impedance matcher may be provided to the process chamber. The impedance matcher may calculate impedances under the substrate supporter in regions with where the stages in simultaneously processing the substrates. The impedance matcher may compare the calculated impedances with a reference impedance to obtain an impedance compensation value. The impedance matcher may identically match the impedances in the regions with the stages with each other using the impedance compensation value. Therefore, when the substrates may be simultaneously processed using the plasma, a process deviation may be reduced to manufacture the substrates with uniformity.