Rotating Plasma Stage Control for Uniform Substrate Irradiation
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in achieving uniform plasma irradiation across the circumferential direction of substrates due to uneven plasma generation, often resulting in non-uniform processing results, especially when the stage rotation is not synchronized with the plasma ON/OFF cycles.
Innovation Solution
A plasma processing apparatus with a rotational drive mechanism and a processing control unit that adjusts the stage's rotation speed and plasma generation period to ensure the stage rotates a specific number of times during plasma generation, ensuring uniform plasma irradiation by correcting the rotation speed and generation period based on acquired processing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the stage rotation speed and plasma generation period are not synchronized, then the processing can be performed independently without coordination, but the plasma irradiation becomes non-uniform in the circumferential direction of the substrate
Solution Approach 1:
The system dynamically adjusts the rotation speed of the stage based on the plasma generation period. The control unit modifies rotational parameters in real-time to ensure that the stage completes an integer number of rotations during plasma generation, achieving uniform plasma irradiation while maintaining independent controllability of the rotation mechanism and plasma generation system.
Solution Approach 2:
The control unit changes the rotational speed parameter of the stage according to the plasma generation period. By adjusting the rotation speed to specific values that satisfy the integer rotation condition during plasma generation, the system achieves uniform plasma distribution without requiring complex mechanical synchronization mechanisms.
2Manufacturing precision
If the stage rotates at high speed during plasma generation, then the plasma irradiation uniformity improves, but the processing time increases due to the need for precise synchronization
Solution Approach 1:
The system employs periodic plasma generation cycles with specific durations (e.g., 1ms, 10ms, 100ms) and synchronizes the stage rotation to complete integer numbers of rotations within each period. This periodic approach allows the stage to rotate at optimized speeds that achieve uniform plasma irradiation while minimizing unnecessary processing time extensions.
Solution Approach 2:
The control unit adjusts the rotation speed parameter based on the selected plasma generation period to optimize processing efficiency. By calculating appropriate rotation speeds that satisfy the integer rotation condition for different period lengths, the system maintains uniform plasma irradiation while avoiding excessive processing time increases.
3Manufacturing precision
If the plasma generation period is extended to ensure complete stage rotations, then the uniformity of plasma irradiation improves, but the productivity decreases due to longer processing cycles
Solution Approach 1:
The system dynamically optimizes the plasma generation period based on the rotation speed and the requirement for integer rotations. The control unit calculates the minimum period necessary to achieve uniform plasma irradiation at the current rotation speed, avoiding unnecessarily extended processing cycles and maintaining high productivity while ensuring quality.
Solution Approach 2:
The control unit adjusts the plasma generation period parameter according to the rotation speed to achieve optimal processing efficiency. By setting the period to values that allow integer rotations at various speeds (e.g., 1ms, 10ms, 100ms), the system maintains uniform plasma irradiation without forcing unnecessarily long processing times.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for equalization of plasma irradiation in the circumferential direction of substrates, improving the uniformity of plasma processing results by synchronizing stage rotation with plasma generation periods.
Implementation Method 1
a generator attached to a wall portion of the processing container facing the stage and generates plasma inside the processing container
Data Source
AI summary
A plasma processing apparatus includes a stage that is located inside a processing container and places a substrate thereon; a rotational drive mechanism that rotationally drives the stage; and a generator that is attached to a wall portion of the processing container facing the stage and generates plasma inside the processing container; an acquisition unit that acquires a processing condition including a generation period and a rotation speed of the stage; and a processing control unit that control at least one of the generation period and the rotation speed such that the stage rotates N times (N is an integer of 1 or more) during generation of the plasma, when performing the plasma processing by generating the plasma inside the processing container by the generator while rotating the stage by the rotational drive mechanism based on the processing condition acquired by the acquisition unit.