Atmospheric Plasma Submicrometric Structuring via Capillary Injection
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Solution Overview
Problem
Current techniques for surface structuring, such as 3D printing and micro plasma jet processes, struggle to achieve submicrometric spatial resolutions due to equipment complexity and cost, with limitations in resolution and scalability for applications like OLED screens and micro-reactors.
Innovation Solution
A method and system utilizing a plasma generated at atmospheric pressure combined with a capillary of submicrometric diameter to inject a gaseous precursor, allowing for localized etching or deposition with resolutions determined by the capillary diameter, rather than the plasma size, and enabling the use of cold plasma and localized heating for enhanced chemical reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If focused ion beam is used to achieve submicron resolution, then manufacturing precision is improved, but device complexity and cost increase due to vacuum requirements
Solution Approach 1:
The patent replaces the mechanical vacuum system and complex ion beam generation equipment with a simpler atmospheric pressure plasma system. By using plasma chemistry reactions at atmospheric pressure instead of focused ion beams requiring vacuum, the invention achieves submicron resolution without the associated vacuum chamber complexity and high costs.
Solution Approach 2:
The invention changes the operating pressure parameter from vacuum to atmospheric pressure, and uses chemical reactions via gaseous precursors instead of physical ion bombardment. This parameter change enables submicron structuring using simpler, more cost-effective equipment while maintaining high spatial resolution through controlled plasma-precursor interactions.
2Device complexity
If conventional 3D printing techniques are used, then device complexity is reduced, but manufacturing precision deteriorates with resolutions limited to tens of micrometers
Solution Approach 1:
The patent applies local quality by confining the plasma-precursor interaction to a highly localized region above the substrate. The plasma is generated in a focused manner and reacts with gaseous precursors only in the immediate vicinity of the substrate surface, enabling submicron feature sizes while using relatively simple atmospheric pressure equipment rather than complex vacuum systems.
3Manufacturing precision
If plasma size is reduced to achieve smaller deposition zones, then manufacturing precision is improved, but the Debye length limits plasma size to above 30 microns at atmospheric pressure
Solution Approach 1:
The patent segments the plasma-precursor system into distinct functional zones: plasma generation region, precursor injection region, and reaction/deposition region on the substrate. By injecting gaseous precursors through the plasma onto the substrate, the deposition zone is defined by the precursor delivery and reaction dynamics rather than the overall plasma size, enabling submicron features even with larger atmospheric pressure plasma.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves submicrometric spatial resolutions, significantly improving upon existing methods by reducing costs and equipment complexity, with potential for high-resolution 2D and 3D printing and engraving, and enabling the production of precise patterns on substrates.
Implementation Method 1
generation of a plasma at atmospheric pressure above said surface
Implementation Method 2
The gaseous precursor and the plasma are chosen to enable localized etching or localized deposition
Implementation Method 3
injection on said surface, through said plasma, of at least one gaseous precursor by means of at least one capillary of submicrometric diameter
Implementation Method 4
the method may also comprise a step of localized heating of the substrate, to increase the kinetics of the chemical reaction of the gaseous precursor and of the plasma
Data Source
Figure 1~2
Figure 3(a)~4
AI summary
The invention relates to a method for submicrometric structuring of a surface (6) of a substrate (3) comprising steps for generating a plasma at atmospheric pressure above said surface (6); and injecting, on said surface (3), through said plasma, at least one gaseous precursor using at least one capillary (5) with a submicrometric diameter. The method can be implemented in a 3D printing system comprising a plate (2) moveable in three directions.