Plasma Substrate Heat Transfer Layer for Temperature Control
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Solution Overview
Problem
Existing plasma processing techniques fail to efficiently adjust the temperature of substrates and edge rings during plasma processing, leading to incomplete temperature control, especially when high heat is input during the process.
Innovation Solution
A method involving a substrate support with a heat transfer medium, such as a liquid or solid medium with fluidity, is supplied between the support surface and the substrate or edge ring to form a heat transfer layer, allowing for efficient temperature adjustment through the support surface during plasma processing, and the temperature adjustment target is separated after processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat transfer gas is supplied between the substrate support and the substrate, then temperature adjustment is possible, but the temperature control efficiency is insufficient when high heat is input during plasma processing
Solution Approach 1:
The patent applies hydraulic principle by using a liquid heat transfer medium instead of gas. The liquid medium is supplied through the substrate support to form a heat transfer layer between the support and substrate, enabling more efficient heat transfer compared to gas-based systems, thus resolving the contradiction between temperature control capability and heat transfer efficiency.
Solution Approach 2:
The patent changes the physical state parameter of the heat transfer medium from gas to liquid. This parameter change significantly improves the thermal conductivity and heat transfer efficiency, allowing effective temperature control even when high heat is input during plasma processing, thereby resolving the energy loss issue.
2Temperature
If a heat transfer gas is supplied for temperature adjustment, then some temperature control is achieved, but the temperature control precision is insufficient
Solution Approach 1:
By using liquid heat transfer medium instead of gas, the system achieves more precise and stable temperature control. The liquid medium provides better thermal contact and more consistent heat transfer properties, improving both temperature control precision and reliability compared to gas-based systems.
Solution Approach 2:
The patent uses a composite approach by combining liquid heat transfer medium with the substrate support structure. This composite system enhances the overall heat transfer performance and temperature control stability, resolving the contradiction between precision and reliability.
3Device complexity
If traditional gas-based heat transfer method is used, then the system structure is simple, but the temperature adjustment efficiency is low
Solution Approach 1:
The patent implements hydraulic heat transfer using liquid medium supplied through the substrate support. Although this adds some structural complexity compared to gas supply, it dramatically improves temperature adjustment efficiency and heat transfer performance, resolving the contradiction between structural simplicity and adjustment efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and efficient temperature control of substrates and edge rings, maintaining stability and improving processing outcomes by utilizing a heat transfer layer with higher thermal conductivity than traditional gas methods.
Implementation Method 1
forming a heat transfer layer by supplying, through the substrate support, a heat transfer medium including at least one of a liquid medium or a solid medium with fluidity to between the support surface of the substrate support and a back surface of the temperature adjustment target
Data Source
AI summary
A processing method for performing plasma processing on a substrate includes placing a temperature adjustment target onto a support surface of a substrate support in a decompressible processing, forming a heat transfer layer by supplying, through the substrate support, a heat transfer medium including at least one of a liquid medium or a solid medium with fluidity to between the support surface of the substrate support and a back surface of the temperature adjustment target, performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed, and separating the temperature adjustment target from the support surface after the plasma processing.