Plasma Supply Units for Uniform RF Power Distribution
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Solution Overview
Problem
Existing deposition apparatuses face challenges in uniformly supplying RF plasma power to multiple reactors, leading to inefficiencies and high costs, with conventional vacuum relays having short lifetimes and frequent contact failures, which limits the throughput of the plasma enhanced atomic layer deposition (PEALD) process.
Innovation Solution
A deposition apparatus with multiple reactors, gas supply units, and plasma supply units that include plasma power suppliers, diodes, reverse voltage drivers, and equivalent circuits, allowing for controlled and uniform RF power distribution through λ/4 equivalent circuits and a channel selector for alternating connections, enhancing switching speed and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum relays are used to supply plasma power to multiple reactors, then the system can operate with simple individual control, but the plasma power cannot be uniformly supplied due to short lifetime and frequent contact failures
Solution Approach 1:
The patent replaces the mechanical vacuum relay system with an electronic switching system using diodes and switches. This substitution eliminates the mechanical contact components that suffer from wear and failure, providing a more reliable plasma power supply mechanism that can uniformly serve multiple reactors without the lifetime limitations of vacuum relays.
Solution Approach 2:
The patent introduces diodes as intermediary components between the plasma power source and the reactors. These diodes act as electronic switches controlled by the switching unit, enabling precise control of plasma power distribution to each reactor. This intermediary electronic control system replaces the direct mechanical relay connection, achieving uniform plasma power supply across multiple reactors.
2Manufacturing precision
If multiple RF generators and matching boxes are applied to each reactor individually, then precise control over each substrate can be achieved, but the cost increases significantly
Solution Approach 1:
The patent implements a single plasma power source that can serve multiple reactors through electronic switching. The switching unit enables one plasma power source to be selectively connected to different reactors, making the system multi-functional. This universal approach maintains precise control capability for each substrate while reducing the total number of RF generators and matching boxes required.
Solution Approach 2:
The patent introduces dynamic switching capability through the switching unit, which can rapidly connect and disconnect the plasma power source to different reactors. This dynamic control allows a single plasma power source to effectively serve multiple reactors with precise temporal control, replacing the need for multiple static power sources while maintaining manufacturing precision.
3Device complexity
If vacuum relays are used for plasma power supply switching, then the system structure can be simplified, but the switching time is long and contact failures occur frequently
Solution Approach 1:
The patent replaces the mechanical vacuum relay switching system with an electronic switching system using diodes and electronically controlled switches. This substitution eliminates the mechanical contact operation that causes slow switching and contact failures. The electronic switching mechanism achieves rapid, reliable plasma power supply switching while maintaining system structural simplicity through integrated electronic control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable and uniform RF plasma power supply to multiple reactors, significantly improving the throughput of the PEALD process by reducing switching time and minimizing operational failures, thereby enhancing productivity.
Implementation Method 1
a plasma power supplier; a plurality of diodes connected to the plasma power supplier; and a reverse voltage driver connected to the plurality of diodes through switches, respectively
Implementation Method 2
The plurality of equivalent circuits may include λ/4 equivalent circuits, respectively
Implementation Method 3
much attention has been paid to a plasma enhanced atomic layer deposition (PEALD) process of which the existing conventional thermal ALD process and a plasma process are combined
Data Source
AI summary
A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reactors; a plurality of gas supply units connected to the plurality of reactors; and a plurality of plasma supply units connected to the plurality of reactors. Each of the plasma supply units includes: a plasma power supplier; a plurality of diodes connected to the plasma power supplier; and a reverse voltage driver connected to the plurality of diodes through respectively corresponding switches.