Plasma Chamber Support Cleaning with a Protective Cover
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Solution Overview
Problem
Existing methods for cleaning parts in plasma processing chambers are inefficient and can cause damage to the parts due to prolonged washing or abrasion, especially when dealing with deposits on surfaces exposed to plasma.
Innovation Solution
A cleaning method involving the removal of parts from the plasma processing chamber, attachment of a protective cover, and generation of a plasma from a cleaning gas to clean adhered substances directly on the support surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional washing or abrasion methods are used to clean deposits on chamber parts, then cleaning can be performed, but the parts may be damaged due to prolonged washing or abrasion
Solution Approach 1:
The patent replaces mechanical cleaning methods (washing and abrasion) with a plasma-based cleaning system. The plasma processing apparatus generates plasma that chemically reacts with and removes deposits from chamber parts without requiring prolonged washing or physical abrasion, thereby eliminating mechanical damage while maintaining cleaning effectiveness.
Solution Approach 2:
The patent changes the cleaning parameter from mechanical force (washing/abrasion) to plasma energy parameters (power, gas flow rate, pressure). By controlling plasma generation parameters such as RF power (100-500W), cleaning gas flow rate (10-100 sccm), and chamber pressure (10-1000 mTorr), the system achieves efficient cleaning without mechanical damage to parts.
2Reliability
If parts are removed from the plasma processing chamber for cleaning, then cleaning can be performed, but the cleaning process becomes time-consuming and reduces productivity
Solution Approach 1:
The patent extracts only the necessary cleaning function from the main plasma processing chamber by introducing a dedicated plasma cleaning system within the chamber. This allows cleaning to be performed in-situ without removing parts, while the extracted plasma generation capability is used specifically for cleaning operations when needed.
Solution Approach 2:
The patent performs preliminary cleaning actions by generating plasma directly in the chamber before deposits become problematic or before part replacement is needed. The system can perform maintenance cleaning during idle periods or between production runs, preventing heavy deposit accumulation and eliminating the need for time-consuming part removal and external cleaning processes.
3Productivity
If plasma is generated from cleaning gas to clean adhered substances, then cleaning efficiency is enhanced, but energy consumption increases
Solution Approach 1:
The patent applies partial plasma generation only when and where needed for cleaning, rather than continuous plasma generation throughout the chamber. The RF power is applied selectively to the substrate or specific chamber regions requiring cleaning, and only for the duration necessary to remove deposits, thereby reducing overall energy consumption while maintaining high cleaning efficiency when active.
Solution Approach 2:
The patent enables continuous or repeated plasma cleaning cycles to be performed in-situ without interrupting the overall production workflow. By performing quick cleaning cycles during idle periods or between substrate loads, the system maintains continuous productive operation with minimal energy input, rather than requiring lengthy external cleaning processes that would stop production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cleaning efficiency and reduces damage to chamber parts by allowing direct plasma cleaning in a controlled manner, effectively removing deposits without prolonged washing or abrasion.
Implementation Method 1
generating a plasma from a cleaning gas, and cleaning an adhered substance adhered to the support by the plasma
Data Source
AI summary
A cleaning method is provided, which is performed by a plasma processing apparatus including a plasma processing chamber and a support configured to support a part in the plasma processing chamber. The cleaning method includes: (A) removing the part from the support in the plasma processing chamber, and transferring the part out from the plasma processing chamber; (B) attaching a protective cover to a position corresponding to an attachment position of the part; and (C) generating a plasma from a cleaning gas, and cleaning an adhered substance adhered to the support by the plasma, wherein (A) is followed by (B), and (B) is followed by (C).