Plasma Chamber Conductive Switching Using Shape Memory Alloy

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Solution Overview

Problem

Existing plasma processing apparatuses require frequent replacement of conductive members when switching between floating and ground voltage states, leading to inefficiencies and increased maintenance costs.

Innovation Solution

A plasma processing apparatus that includes a shape memory alloy (SMA) current supply actuator, which changes its shape in response to temperature changes induced by applied voltage or current, allowing for seamless switching between ground and floating states of conductive members without the need for mechanical drives or additional power supplies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive member is used in plasma processing apparatus, then electrical connection is established, but frequent replacement is required when switching between floating and ground voltage states

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidmaintenance time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The conductive member's electrical state is made dynamic through temperature-controlled shape change. The third member changes its shape based on temperature variations, enabling the conductive member to switch between connected and disconnected states without physical replacement, thus resolving the contradiction between maintaining reliable electrical connection and reducing maintenance time

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention changes the temperature parameter of the third member to control the shape change. By varying temperature, the system transitions between different electrical states (floating and ground voltage) without mechanical replacement, addressing both the reliability requirement and the maintenance time reduction goal

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If mechanical drives are used for switching conductive members, then state switching is achieved, but device complexity increases

Engineering Contradiction:
Improvestate switching capabilityVSAvoidmechanical drive structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The invention replaces the mechanical drive system with a temperature-based shape change mechanism. The third member's shape changes in response to temperature variations, eliminating the need for complex mechanical drives while achieving the required state switching capability between floating and ground voltage states

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The third member utilizes phase transition or shape memory effect where material structure changes with temperature. This phase transition enables automatic shape change and state switching without mechanical intervention, reducing device complexity while maintaining operational capability

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient switching between electrical connection and disconnection states of conductive members, reducing maintenance needs and providing a quiet, simple apparatus structure while maintaining plasma generation capabilities.

Implementation Method 1

a third member disposed on at least one selected from the group of the first conductive member and the second conductive member and having a shape that varies according to a temperature change of the third member

Methodology Applied
Scientific EffectShape memory alloy effect: Shape Memory Alloy

Data Source

PatentUS12148598B2Plasma processing apparatus
Publication Date: 2024.11.19 TOKYO ELECTRON LTD
  • US12148598B2 patent drawing
  • US12148598B2 patent drawing
  • US12148598B2 patent drawing

AI summary

A plasma processing apparatus includes: a plasma processing chamber; a first conductive member disposed in the plasma processing chamber and having a first surface; a second conductive member having a second surface facing the first surface of the first conductive member; a third member disposed on at least one selected from the group of the first conductive member and the second conductive member and having a shape that varies according to a temperature change of the third member; and a control mechanism configured to change a temperature of the third member.