Plasma Substrate Temperature Correction Using Heater Power Feedback
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Solution Overview
Problem
Existing plasma processing technologies face challenges in maintaining precise temperature control of substrates during plasma generation, leading to inconsistencies and inefficiencies.
Innovation Solution
A plasma processing apparatus with a substrate support system that includes a heater, temperature sensor, and electric power adjuster, which adjusts power supply to maintain stable substrate temperatures by calculating and correcting for heat input from plasma generation, using thermal resistance values to refine temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a heater is used to maintain substrate temperature, then temperature stability is improved, but the complexity of temperature control increases due to the need for separate electric power adjustment before and during plasma generation
Solution Approach 1:
The patent applies preliminary action by measuring the heater power required to maintain substrate temperature before plasma generation, then using this measurement to calculate and set the appropriate heater power during plasma generation. This preliminary measurement and calculation approach simplifies the overall control system while maintaining temperature stability throughout the plasma processing operation.
2Ease of operation
If temperature control is performed without considering plasma heat input, then the control method is simple, but temperature control precision deteriorates during plasma generation
Solution Approach 1:
The patent implements feedback by measuring the heater power consumed before plasma generation, using this measurement to calculate the heat input from plasma, and then adjusting the heater power during plasma generation based on this calculation. This feedback loop maintains temperature control precision while keeping the control method relatively simple and systematic.
3Ease of operation
If thermal resistance between substrate support and temperature sensor is not considered, then measurement is simpler, but temperature measurement accuracy deteriorates
Solution Approach 1:
The patent uses thermal resistance as an intermediary parameter to bridge the gap between the temperature sensor measurement and the actual substrate temperature. By introducing thermal resistance into the temperature calculation model, the system can accurately determine substrate temperature even when the sensor is positioned away from direct contact with the substrate, thus maintaining measurement accuracy without complicating the measurement process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the controllability of substrate temperatures during plasma processing, ensuring consistent and efficient operation by compensating for heat fluctuations caused by plasma generation.
Implementation Method 1
a first heater disposed inside the substrate support and configured to adjust a temperature of the substrate support surface
Implementation Method 2
a first temperature sensor configured to measure the temperature of the substrate support surface
Implementation Method 3
after the plasma is generated, when the temperature of the substrate support surface measured by the first temperature sensor stabilizes at the first temperature
Data Source
AI summary
A plasma processing method includes: setting a temperature of a substrate support surface to a first temperature; supplying electric power from an electric power adjuster to a heater; before plasma is generated, when the temperature of the substrate support surface measured by a temperature sensor stabilizes at the first temperature, measuring first electric power supplied to the heater; after the plasma is generated, when the temperature of the substrate support surface measured by the temperature sensor stabilizes at the first temperature, measuring second electric power supplied to the heater; calculating an input heat quantity input from the plasma based on the first electric power and the second electric power; and correcting the first temperature to a second temperature based on the input heat quantity and a thermal resistance between the substrate support and the temperature sensor or between a substrate and the temperature sensor.