Plasma Chamber Temperature Estimation Using Time-Series Process Data

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Solution Overview

Problem

In semiconductor fabrication processes, accurately estimating temperature inside a plasma processing space is challenging due to changes in conditions, leading to reduced estimation accuracy when direct temperature measurement is not feasible.

Innovation Solution

A temperature estimation apparatus that uses a time series model generated from historical process and temperature data to estimate temperature changes within the plasma processing space, allowing for real-time monitoring and adjustment of plasma processing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If indirect temperature estimation is used in plasma processing, then temperature measurement becomes feasible without installing sensors inside the processing space, but estimation accuracy deteriorates when conditions inside the processing space change

Engineering Contradiction:
Improvetemperature measurement feasibilityVSAvoidtemperature estimation accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The system performs preliminary actions by acquiring process conditions before plasma processing starts and using this data to generate or update a time series model in advance. This preliminary modeling enables accurate temperature estimation during processing without requiring real-time sensor installation, thus resolving the contradiction between measurement feasibility and accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by successively inputting time series process data during plasma processing and continuously updating temperature estimates. The model learns from actual process data and adjusts predictions in real-time, maintaining high accuracy even when conditions change, while still avoiding the need for physical temperature sensors inside the processing space.

Inventive Principle:
Principle #23Feedback

2Device complexity

If process conditions are kept constant for temperature estimation, then estimation simplicity is maintained, but adaptability to changing conditions inside the processing space is reduced

Engineering Contradiction:
Improveestimation method simplicityVSAvoidresponse to condition changes
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The system applies dynamics by using a time series model that can adapt to changing conditions. Instead of relying on static process conditions, the model processes time series data that captures dynamic changes in the plasma processing environment. This allows the estimation system to remain relatively simple in structure while being highly adaptive to condition changes through its ability to process sequential data.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system implements parameter changes by utilizing time series process data that captures variations in processing conditions over time. The model learns relationships between changing parameters and temperature, enabling it to adapt to different processing scenarios without requiring a completely different estimation approach for each condition change.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12170193B2Temperature estimation apparatus, plasma processing system, temperature estimation method and temperature estimation program
Publication Date: 2024.12.17 TOKYO ELECTRON LTD
  • US12170193B2 patent drawing
  • US12170193B2 patent drawing
  • US12170193B2 patent drawing

AI summary

A temperature estimation apparatus includes an estimation unit configured to successively estimate temperature data by successively inputting given time series process data relating to conditions inside a processing space in which plasma processing is performed, into a time series model generated in advance that correlates data values, in each time period, of time series process data relating to conditions inside the processing space, with a data value, at a respective time point, of time series temperature data measured inside the processing space.