Integrated Plasma-Thermal Chamber for Faster Wafer Processing
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Solution Overview
Problem
Current semiconductor processing technologies require separate devices for plasma processing and thermal treatments, leading to increased manufacturing costs and time.
Innovation Solution
A processing apparatus that integrates both plasma processing and thermal treatments in a single chamber, featuring a plasma chamber separated from a processing chamber, a gas supply system, a plasma source, a workpiece support, radiative heat sources, a dielectric window, and a rotation system with a magnetic actuator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate devices are used for plasma processing and thermal treatments, then processing quality is maintained, but manufacturing cost and processing time increase
Solution Approach 1:
The patent combines plasma processing chamber and thermal processing chamber into a single integrated device, allowing both plasma treatment and thermal treatment to be performed on workpieces within the same apparatus. This merging of functions enables simultaneous or sequential processing operations, reducing the need for multiple separate devices and thereby decreasing manufacturing cost and processing time while maintaining processing quality
2Productivity
If separate devices are used for plasma processing and thermal treatments, then device functionality is specialized, but manufacturing cost increases
Solution Approach 1:
The integrated processing device is designed to perform multiple functions including plasma processing, thermal processing, and combined plasma-thermal processing on workpieces. By incorporating both plasma generation systems and thermal treatment systems within a single apparatus, the device achieves multi-functionality that allows it to replace multiple specialized devices, thereby reducing manufacturing cost while maintaining versatile processing capabilities
3Loss of time
If plasma and thermal processing are performed separately, then process control is simplified, but fabrication time increases
Solution Approach 1:
The patent merges plasma processing and thermal processing into a single integrated system where both processing modes can be performed on workpieces within the same chamber. This combination allows for seamless transition between processing modes and enables combined plasma-thermal processing sequences without requiring workpiece transfer between separate devices, thereby significantly reducing fabrication time despite the increased system integration complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous plasma and thermal processing in a single chamber, reducing fabrication time and costs, and allowing for more efficient workpiece processing with improved temperature control.
Implementation Method 1
a plasma source configured to generate a plasma from the one or more process gases in the plasma chamber
Implementation Method 2
one or more radiative heat sources configured on a second and opposite side of the first side of the processing chamber, the radiative heating sources configured to heat the workpiece from the back side of the workpiece
Implementation Method 3
a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator
Data Source
AI summary
A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. One or more radiative heat sources configured to heat the workpiece disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. The processing apparatus includes a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator.