Plasma Through-Hole Sensing for Accurate Chamber Ion Mapping
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Solution Overview
Problem
Existing methods for observing plasma distribution in a chamber for substrate processing suffer from low accuracy and interference issues, whether through optical spectrum observation or direct probe insertion.
Innovation Solution
An apparatus and method that measure induced electromotive force values generated by ions passing through through-holes in an upper plate using a sensing member and integrator circuit to detect ion amounts and monitor plasma distribution without interfering with the plasma.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a probe is directly inserted into the plasma space for observation, then measurement precision is improved, but the probe causes interference with the plasma
Solution Approach 1:
The patent uses an upper plate with through-holes as an intermediary structure. The sensing member is positioned behind the upper plate, detecting plasma parameters through the through-holes rather than direct insertion. This intermediary arrangement allows measurement while maintaining plasma integrity and avoiding direct contamination or disturbance of the plasma environment.
Solution Approach 2:
The upper plate is segmented with multiple through-holes distributed across its surface. This segmentation allows the sensing member to detect plasma parameters at multiple discrete locations, providing spatial distribution information while maintaining the protective barrier function of the upper plate structure.
2Object-affected harmful factors
If optical spectrum observation is used to monitor plasma, then interference with plasma is avoided, but measurement precision deteriorates
Solution Approach 1:
The upper plate with through-holes serves as an intermediary that enables direct electrical measurement without requiring optical access. The sensing member can be positioned behind the upper plate, using the through-holes as measurement access points, thereby achieving both non-interference and high-precision electrical parameter detection.
3Loss of information
If multiple sensing members are disposed at different locations in the upper plate to measure plasma distribution, then plasma distribution information is improved, but device complexity increases
Solution Approach 1:
The upper plate structure serves multiple functions: it acts as a protective barrier, provides structural support, and simultaneously serves as a mounting platform for multiple sensing members. The through-holes in the upper plate are universally applicable for various measurement locations, allowing the same structural design to be reused across multiple measurement points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately monitors plasma distribution and ion amounts within the chamber, providing precise control over the substrate processing without disrupting the plasma environment.
Implementation Method 1
measuring an induced electromotive force value generated in a measurement through-hole included in the plurality of through-holes
Implementation Method 2
a plasma generation unit supplying processing gas to the processing space and generating plasma from the processing gas above the upper plate
Data Source
AI summary
An apparatus for and a method of processing a substrate are provided. The apparatus for processing a substrate includes a chamber having a processing space therein, a substrate support member disposed inside the chamber and supporting the substrate, an upper plate disposed above the substrate support member and having a plurality of through-holes, a sensor unit disposed inside the upper plate and measuring an induced electromotive force value generated in a measurement through-hole included in the plurality of through-holes, and a detection unit detecting an amount of ions passing through the measurement through-hole based on the induced electromotive force value.