Plasma Top Plate Thickness Calculation via Heater Power

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In plasma processing apparatuses, determining the degree of top plate consumption is challenging, leading to fluctuations in etching characteristics and uniformity, which reduces productivity due to the need for conservative replacement times based on past results rather than actual consumption levels.

Innovation Solution

The apparatus includes a support with a detachable top plate and a heater controller that measures and adjusts temperature, using a parameter calculator to calculate the top plate thickness by fitting a calculation model with measured supply power in non-ignition and transient states, allowing for precise determination of top plate consumption without direct thickness measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conservative replacement times based on past results are used, then reliability of etching characteristics is maintained, but productivity decreases due to unnecessary early replacements

Engineering Contradiction:
Improveetching characteristics stabilityVSAvoidproductivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces direct mechanical thickness measurement with an electrical measurement system. By measuring supply power changes in the heater during plasma ignition and transient states, the system indirectly determines top plate thickness without physical contact or direct measurement, thus maintaining reliability while improving productivity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces supply power measurement as an intermediary parameter to determine top plate thickness. Instead of directly measuring thickness, the system measures the electrical power consumed by the heater, which changes predictably with top plate thickness, providing an indirect but accurate measurement method

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If direct thickness measurement methods are used, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvetop plate thickness measurement accuracyVSAvoidmeasurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent makes the existing heater serve multiple functions: it not only heats the top plate for plasma generation but also acts as a measurement sensor for thickness determination. By measuring the supply power to this multi-functional heater, the system achieves thickness measurement without adding separate measurement devices, thus improving precision while minimizing complexity increase

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heater automatically provides measurement information through its own operating characteristics. The change in supply power required to maintain constant heater temperature directly indicates top plate thickness, allowing the system to self-diagnose without external measurement equipment

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables timely and accurate determination of top plate consumption, improving productivity by allowing for optimized maintenance schedules and reducing the need for conservative replacement times, thus enhancing the overall efficiency of the plasma processing system.

Implementation Method 1

a heater capable of adjusting the temperature of a support surface of the top plate

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

measure a supply power in a non-ignition state where the plasma is not ignited and in a transient state where the supply power to the heater is reduced after the plasma is ignited

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11621177B2Plasma processing apparatus and calculation method
Publication Date: 2023.04.04 TOKYO ELECTRON LTD
  • US11621177B2 patent drawing
  • US11621177B2 patent drawing
  • US11621177B2 patent drawing

AI summary

A plasma processing apparatus includes a measurement unit that, while controlling a supply power to a heater such that a temperature of the heater becomes constant, measures the supply power to the heater in a non-ignition state where a plasma is not ignited and in a transient state where the supply power to the heater is reduced after the plasma is ignited. The plasma processing apparatus also includes a parameter calculator that calculates a thickness of a top plate by performing a fitting on a calculation model which includes the thickness of the top plate as a parameter and calculates the supply power in the transient state, using the measured supply power in the non-ignition state and the transition state.