Plasma-Treated Encapsulating Substrate for OLED Moisture Barrier
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Solution Overview
Problem
Conventional organic electroluminescence devices face issues with moisture permeation, structural fragility, and high costs due to complex manufacturing processes and inadequate interfacial adhesion between substrates and sealants, which affect their durability and reliability.
Innovation Solution
A method involving the formation of a transparent nano-porous oxide encapsulating layer using a sol-state composition, followed by plasma treatment to clean the substrate region where the sealant is applied, enhancing interfacial adhesion and moisture absorption, and combining substrates under reduced pressure with a sealant that undergoes UV and thermal curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a film type desiccant is used for passivation, then the manufacturing process is simplified, but the interfacial adhesion between substrate and sealant deteriorates and the structure becomes fragile
Solution Approach 1:
The patent applies plasma treatment to the substrate surface before applying the sealant. This preliminary action cleans and activates the substrate surface, creating hydroxyl groups that enhance the chemical bonding between the substrate and sealant, thereby improving interfacial adhesion and preventing delamination during subsequent processing or use.
Solution Approach 2:
The patent changes the surface energy and chemical composition parameters of the substrate through plasma treatment. This modification transforms the substrate surface from a low-energy, non-reactive state to a high-energy, chemically active state with hydroxyl groups, enabling strong covalent bonding with the sealant and resolving the adhesion problem.
2Illumination intensity
If a transparent encapsulating layer is used for front emission, then the device appearance is improved, but circumferential contamination and outgassing occur during manufacturing
Solution Approach 1:
The patent performs plasma treatment on the encapsulating layer before sealant application. This preliminary cleaning action removes organic contaminants and outgassing residues from the transparent encapsulating layer surface, preventing circumferential contamination while maintaining the layer's transparency for front emission.
Solution Approach 2:
The patent conducts plasma treatment in a controlled atmosphere to prevent contamination during the cleaning process. The plasma environment provides an inert processing condition that prevents new contamination while effectively removing existing contaminants from the transparent encapsulating layer.
3Object-affected harmful factors
If conventional sealing structures with grooves and powder desiccant are used, then moisture absorption is achieved, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The patent extracts and removes the complex groove structure and powder desiccant loading process from the sealing system. Instead, it uses a simplified planar encapsulating layer with plasma-treated surface for sealant bonding, achieving equivalent or superior moisture protection without the manufacturing complexity of grooves and powder handling.
Solution Approach 2:
The patent employs a thin film encapsulating layer with plasma-treated surface that provides flexible, effective moisture barrier functionality. This thin film approach replaces the bulky groove-and-powder structure, simplifying manufacturing while maintaining moisture absorption and barrier capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the interfacial adhesion between the sealant and substrate, effectively preventing moisture and air permeation, leading to enhanced durability and extended lifetime of organic electroluminescence devices.
Implementation Method 1
performing a plasma treatment on the encapsulating substrate having the encapsulating layer
Implementation Method 2
a transparent, moisture-absorbing encapsulating layer
Implementation Method 3
applying a sealant to at least one of the plasma treated encapsulating substrate and a substrate on which an organic electroluminescent unit including a first electrode, an organic layer, and a second electrode, which are sequentially stacked, is deposited
Implementation Method 4
forming an encapsulating layer by coating an encapsulating substrate with an encapsulating layer-forming composition and thermally processing the encapsulating substrate
Data Source
AI summary
A method of manufacturing an organic electroluminescence device whereby an encapsulating layer is formed by coating an encapsulating substrate with an encapsulating layer-forming composition and thermally processing the encapsulating substrate. A plasma treatment is performed on the encapsulating substrate having the encapsulating layer. A sealant is applied to at least one of the plasma treated encapsulating substrate and a substrate on which an organic electroluminescent unit including a first electrode, an organic layer, and a second electrode, which are sequentially stacked, is deposited. The sealing substrate and the substrate on which the organic electroluminescent unit is deposited are combined. Contaminants generated around the encapsulating layer and generated in the thermal process can be effectively removed by the cleaning process using plasma. Therefore, the interfacial adhesion between the sealant and the substrate is greatly improved, thereby preventing permeation of external air, moisture, etc., into the device.