Plasma-Treated LED Resin Encapsulant Interface
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Solution Overview
Problem
The formation of air layers and separation between resin encapsulants and molding members in light emitting diode packages due to differences in thermal expansion coefficients and materials, leading to reduced light radiation characteristics and lifespan.
Innovation Solution
A method of fabricating light emitting diode packages involving a chip mounting member with insulated leads, where the resin encapsulant is surface-treated using plasma to increase bonding forces with the resin molding member, preventing air layer formation and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin encapsulant and resin molding member are formed of different materials, then protection of light emitting diode chip from moisture and external force is improved, but air layer formation and separation at interface occur
Solution Approach 1:
The invention applies plasma treatment to the surface of the resin encapsulant, changing its surface properties (increasing surface energy and roughness) to enhance adhesion with the resin molding member. This parameter change in surface characteristics resolves the interface stability issue while maintaining the benefit of using different materials for protection.
2Reliability
If resin encapsulant with low hardness and resin molding member with high hardness are used, then light emitting diode chip is protected from moisture and external force, but cracks or deformation of resin encapsulant occur due to thermal expansion differences
Solution Approach 1:
Plasma treatment modifies the surface parameters of the resin encapsulant, creating a more compliant interface that can better accommodate thermal expansion differences. The treated surface forms a gradient structure that reduces stress concentration, preventing cracks and deformation while maintaining protective function.
3Ease of manufacture
If air layer forms in interface between resin encapsulant and resin molding member, then manufacturing is simpler, but light radiation characteristic changes and package lifespan reduces
Solution Approach 1:
The plasma treatment is performed as a preliminary action on the resin encapsulant surface before bonding with the molding member. This pre-treatment ensures optimal bonding conditions are established in advance, preventing air layer formation during the bonding process while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the bonding force between the resin encapsulant and molding member, preventing air layer formation and separation, thereby maintaining light radiation characteristics and extending the package's lifespan.
Implementation Method 1
the resin encapsulant is surface treated using plasma
Data Source
AI summary
Disclosed are a method of fabricating a light emitting diode package with a surface treated resin encapsulant and a package fabricated by the method. According to the method of fabricating a light emitting diode package, a resin encapsulant encapsulating a light emitting diode chip is surface treated using plasma. Thus, a bonding force between the surface treated resin encapsulant and a resin molding member covering it is increased.