Plasma Treatment for IC Packaging Bond Reliability
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Solution Overview
Problem
The challenge in integrated circuit packaging is to achieve miniaturization, increased density, and reduced costs while maintaining reliable connections and low equipment utilization costs, as existing technologies fail to effectively address these requirements.
Innovation Solution
A method involving a two-step plasma process using dioxygen and dihydrogen to remove the organic surface protection layer from conductive pads, followed by forming an underfill and achieving reliable connections through thermal compression bonding with a reduced bond force, enhancing yield and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional single-step plasma processing is used to remove organic surface protection layer, then the process is simple and fast, but the connection reliability is insufficient and bond force must be high
Solution Approach 1:
The plasma processing step is segmented into two distinct sequential steps: first an oxygen plasma step to condition the organic surface protection layer, then a hydrogen plasma step to remove the layer. This segmentation allows each step to be optimized for its specific function, achieving complete layer removal and reliable connections without requiring excessively high bond force.
2Reliability
If high bond force is applied in thermal compression bonding, then reliable connections are achieved, but equipment utilization costs increase and finer pitch applications are limited
Solution Approach 1:
The oxygen and hydrogen plasma treatment steps are performed as preliminary actions before thermal compression bonding. These preliminary plasma steps modify the conductive pad surface to enhance bonding characteristics, which allows subsequent bonding to achieve reliable connections at reduced bond force, thereby lowering equipment utilization costs and enabling finer pitch applications.
3Volume of moving object
If miniaturization is pursued to reduce product size, then portability improves, but packaging density requirements increase and manufacturing becomes more difficult
Solution Approach 1:
The plasma processing parameters (gas composition, power, pressure, treatment time) are optimized to achieve effective removal of the organic surface protection layer on miniaturized conductive pads. This parameter optimization enables reliable bonding in miniaturized packages without increasing manufacturing difficulty, supporting continued product size reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves yield and reduces equipment utilization costs by providing reliable connections with a lower bond force, enabling finer pitch applications and lower stress processes, thus addressing the need for miniaturization and cost reduction in integrated circuit packaging.
Implementation Method 1
removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen
Implementation Method 2
heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system including: heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad; removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen, wherein the second step immediately follows the first step; and forming an underfill over the conductive pad.