Plasma Chamber Wall Cooling Structure for Uniform Circumferential Temperature
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Solution Overview
Problem
Existing plasma processing apparatuses experience significant temperature differences along the circumferential direction of the wall members due to uneven cooling by cooling gases, leading to inefficiencies and potential material degradation.
Innovation Solution
The implementation of a pipe member within the cooling gas cavity of the wall member, formed of a material with lower thermal conductivity than the wall body, featuring adjustable hole sizes and spacings to evenly distribute cooling gas flow and reduce temperature gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling gas is circulated through a channel in the wall member, then cooling effect is achieved, but significant temperature differences occur along the circumferential direction
Solution Approach 1:
The wall member is divided into multiple independent cooling channels arranged along the circumferential direction. Each channel receives cooling gas independently, allowing segmented control of cooling zones to achieve uniform temperature distribution around the processing chamber.
Solution Approach 2:
Different regions of the wall member are provided with cooling channels having different characteristics (such as varying hole sizes, spacings, or channel dimensions) to match the local thermal requirements. This ensures that each zone receives appropriate cooling intensity to maintain overall temperature uniformity.
2Temperature
If cooling gas flow is increased to improve cooling efficiency, then temperature control improves, but temperature differences along the circumferential direction increase
Solution Approach 1:
The cooling system is segmented into multiple independent channels that can be controlled separately. This allows the cooling gas flow to be distributed evenly across different circumferential positions, preventing localized overheating while maintaining overall temperature control.
Solution Approach 2:
The cooling channels are designed to create equipotential temperature distribution along the circumferential direction by ensuring equal pressure drops and flow rates in each channel. This balances the cooling effect around the entire wall member, eliminating temperature gradients.
3Device complexity
If a simple cooling channel structure is used, then device complexity is reduced, but cooling gas distribution becomes uneven
Solution Approach 1:
The cooling system uses multiple simple parallel channels instead of a single complex channel. This segmented approach maintains structural simplicity while achieving uniform gas distribution through parallel flow paths that naturally balance pressure and flow rates.
Solution Approach 2:
The cooling channels are designed with slightly excessive cooling capacity in each individual channel to ensure that even with variations in gas flow, the cumulative effect across all channels achieves uniform temperature distribution. This redundancy compensates for minor imbalances in the simple channel structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform temperature distribution along the circumferential direction of the wall members, enhancing cooling efficiency and reducing material stress, thereby improving the apparatus's performance and longevity.
Implementation Method 1
a cooling gas flow circulating section configured to circulate a cooling gas through the cooling gas cavity
Implementation Method 2
a pipe member disposed in the cooling gas cavity, formed of a member having lower thermal conductivity than the inner wall member or outer wall member
Data Source
AI summary
A wall member body is provided in a circumferential direction of a processing container, and provided with a first cavity formed along the circumferential direction inside. A pipe member is disposed in the first cavity, formed of a member having lower thermal conductivity than the wall member body, provided with a second cavity formed to flow a cooling gas inside, and provided with one or more holes formed to cause the first cavity and the second cavity to communicate with each other.