Plasma Processing Apparatus Window Alignment for Etching Yield
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Solution Overview
Problem
The existing plasma processing methods for substrates held on transport carriers face issues with low yield and variation in etching shape due to exposure of the transport carrier and holding sheet to plasma, leading to potential damage and unprocessed portions during the dicing process.
Innovation Solution
A plasma processing apparatus and method that includes a transport mechanism, position measuring section, and control section to precisely align the substrate with respect to the plasma processing stage, using a cover with a window section to expose only the substrate while protecting the transport carrier and holding sheet, ensuring uniform plasma exposure and improved positional matching between the substrate and the window section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the transport carrier is directly exposed to plasma, then the substrate can be processed, but the holding sheet and adhesive are heated causing elongation and deterioration
Solution Approach 1:
The plasma processing area is segmented by introducing a cover with a window section. The window section is positioned to expose only the substrate to plasma while the cover protects the holding sheet and frame. This spatial segmentation allows selective plasma exposure, enabling etching precision improvement without compromising holding sheet integrity.
2Reliability
If the cover is used to protect the transport carrier, then the holding sheet is protected from plasma damage, but the yield is low and etching shape variation occurs
Solution Approach 1:
A position measuring section is introduced to measure the substrate position relative to the frame before plasma processing. The control section uses this measurement information to adjust the transport carrier position, ensuring accurate alignment between the substrate and window section. This feedback mechanism eliminates etching shape variation while maintaining holding sheet protection.
3Measurement precision
If precise matching of substrate center and frame center is required, then alignment accuracy improves, but the device complexity and operation difficulty increase
Solution Approach 1:
The position measuring section automatically measures the substrate position relative to the frame, and the control section automatically adjusts the transport carrier position based on this measurement. This self-service positioning system eliminates the need for manual alignment operations, achieving high alignment accuracy without increasing operational complexity.
4Manufacturing precision
If the window section is made smaller to expose only necessary substrate areas, then plasma processing precision improves, but the productivity decreases due to unprocessed edge portions
Solution Approach 1:
The transport carrier positioning is made dynamic and adjustable based on measured substrate positions. The control section adjusts the transport carrier position to ensure the window section is optimally positioned over the substrate processing area. This dynamic positioning ensures complete substrate exposure for etching while maintaining high precision, eliminating unprocessed edge portions and improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of the plasma etching process by preventing damage to the transport carrier and holding sheet, reducing variation in the etching shape of the substrate edges, and ensuring uniform plasma processing without requiring precise matching of the substrate center and frame center.
Implementation Method 1
plasma processing section that includes a plasma processing stage on which the transport carrier holding the substrate is loaded
Data Source
AI summary
A plasma processing apparatus that performs plasma processing to a substrate held on a transport carrier including a frame and a holding sheet that covers an opening of the frame includes: a transport mechanism that transports the transport carrier; a position measuring section that measures a position of the substrate to the frame; a plasma processing section that includes a plasma processing stage on which the transport carrier is loaded and a cover that covers the frame and a part of the holding sheet loaded on the plasma processing stage, and has a window section for exposing a part of the substrate; and a control section that controls the transport mechanism such that the transport carrier is loaded on the plasma processing stage to satisfy a positional relationship between the window section and the substrate based on the position information of the substrate to the frame.