On-Chip Plasmon Detector for Inter-Chip Optical Communication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuits (ICs) face limitations in increasing functionality, such as inter-chip optical communications, which often require external devices and connections, and existing ultra-small resonant structures for optical data transfer are not effectively integrated with ICs to enhance these functionalities.
Innovation Solution
Integration of ultra-small resonant structures, including a source of charged particles, an anode and focusing deflector plates, and a detector system with ICs, where a transmission line on the IC disrupts and detects plasmon waves caused by light waves, enabling data signal detection and transfer within the IC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If external devices and connections are used for inter-chip optical communications, then communication functionality is achieved, but device complexity and external dependencies increase
Solution Approach 1:
The patent combines the optical communication functionality directly into the integrated circuit chip by integrating an electromagnetic detector with the IC substrate. This merging eliminates the need for separate external optical communication devices and connections, thereby reducing device complexity while maintaining inter-chip communication capability. The detector is formed using standard IC fabrication processes and integrated with on-chip antenna structures, achieving monolithic integration of optical communication functions.
2Adaptability or versatility
If ultra-small resonant structures are used for optical data transfer, then optical data transfer function is achieved, but integration with standard ICs is ineffective
Solution Approach 1:
The patent designs the electromagnetic detector and associated structures to be compatible with standard IC fabrication processes, allowing the same manufacturing platform to produce both conventional electronic circuits and optical detection functions. The detector utilizes standard semiconductor materials and processing techniques, enabling universal manufacturing across different IC technologies. This multi-functionality approach allows a single fabrication process to simultaneously create electronic logic circuits and optical communication components.
Solution Approach 2:
The electromagnetic detector structure is nested within the integrated circuit substrate, with the detector formed as part of the IC layer structure. The antenna elements and detector components are integrated within the same chip footprint, with the detector positioned to receive optical signals while coexisting with other IC components. This nested integration allows optical data transfer functionality to be embedded within the standard IC architecture without requiring separate discrete components.
3Adaptability or versatility
If functionality of existing ICs is increased through external devices, then functional capability is improved, but loss of time and system efficiency deteriorate
Solution Approach 1:
By integrating the electromagnetic detector directly onto the IC substrate using standard fabrication processes, the patent eliminates the time-consuming external connection and assembly steps required for conventional optical communication systems. The detector is formed simultaneously with other IC components during the manufacturing process, eliminating post-assembly integration time and reducing system deployment time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for enhanced inter-chip optical communications by effectively detecting and processing data-encoded plasmon waves within the IC, improving functionality without the need for external devices and enhancing data transfer capabilities.
Implementation Method 1
detect plasmon waves indicative of data signals
Implementation Method 2
ultra-small resonant structures to detect and process plasmon waves generated by light waves
Implementation Method 3
utilizing an ultra-small resonant transmission line that deflects charged particle beams to detect plasmon waves
Data Source
AI summary
A device includes an integrated circuit (IC) and at least one ultra-small resonant structure and a detection mechanism are formed on said IC. At least the ultra-small resonant structure portion of the device is vacuum packaged. The ultra-small resonant structure includes a plasmon detector having a transmission line. The detector mechanism includes a generator mechanism constructed and adapted to generate a beam of charged particles along a path adjacent to the transmission line; and a detector microcircuit disposed along said path, at a location after said beam has gone past said line, wherein the generator mechanism and the detector microcircuit are disposed adjacent transmission line and wherein a beam of charged particles from the generator mechanism to the detector microcircuit electrically couples a plasmon wave traveling along the metal transmission line to the microcircuit. The detector mechanism may be electrically connected to the underlying IC.