3D Semiconductor Package With Plasmonic Bridge for Low-Loss Optical I/O
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Solution Overview
Problem
Current optical transceiver modules in high-speed optical communication systems face challenges with complex fabrication processes and significant optical loss, which affect performance and efficiency.
Innovation Solution
The implementation of a manufacturing process that involves hybrid bonding and the use of plasmonic waveguides to stack photonic and storage integrated circuit components, along with a redistribution structure, to reduce optical loss and enhance data transfer rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional fabrication processes are used for optical transceiver modules, then manufacturing complexity is high, but optical loss is severe
Solution Approach 1:
The patent segments the optical transceiver module into multiple functional layers including photonic integrated circuit components, storage integrated circuit components, and redistribution structures. Each layer is optimized independently to reduce optical loss while maintaining manufacturing feasibility.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking architecture, where photonic and storage components are vertically integrated. This dimensional change reduces optical path length and minimizes optical loss without significantly increasing fabrication complexity.
2Productivity
If optical transceiver density is increased in a given area, then system performance improves, but fabrication complexity increases
Solution Approach 1:
The patent employs three-dimensional stacking to increase the number of optical transceivers within a given footprint area. By utilizing vertical space rather than only horizontal expansion, the system achieves higher data transfer rates without proportionally increasing fabrication complexity.
Solution Approach 2:
The redistribution structure serves multiple functions simultaneously: it provides electrical interconnection between stacked components, manages thermal dissipation, and facilitates optical signal routing. This multi-functionality increases transceiver density without adding proportional fabrication steps.
3Use of energy by moving object
If current density is reduced to lower power consumption, then energy efficiency improves, but signal transmission capability may be compromised
Solution Approach 1:
The patent replaces traditional electrical signal transmission with optical signal transmission through photonic integrated circuit components. This substitution allows for lower current density and reduced power consumption while maintaining or enhancing signal transmission capability through optical channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced signal loss, lower current density, and increased data transfer rates, while allowing for the integration of more optical transceivers within a given area, thereby improving the performance and efficiency of high-speed optical communication systems.
Implementation Method 1
a plasmonic waveguide PW1 may be formed to optically couple the optical input/output portion P1 of the first optical transceiver OT1, the optical input/output portion P2 of the second optical transceiver OT2, and the optical input/output portion P3 of the third optical transceiver OT3
Data Source
AI summary
A semiconductor package includes a first electric integrated circuit component, a second integrated circuit component, and a first plasmonic bridge. The second electric integrated circuit component is aside the first electric integrated circuit component. The first plasmonic bridge is vertically overlapped with both the first electric integrated circuit component and the second electric integrated circuit component. The first plasmonic bridge includes a first plasmonic waveguide optically connecting the first electric integrated circuit component and the second electric integrated circuit component.