Plasmonic Via Light Interconnection for High-Speed IC Communication

The patent replaces electrical signal transmission with optical signal transmission. Specifically, electrical signals are converted to optical signals through light-emitting structures (such as LEDs or lasers) that couple light into optical waveguides. This substitution eliminates electrical resistance and electromagnetic interference, enabling higher communication speeds and better signal reliability between semiconductor ICs.

The patent changes the fundamental parameter of signal transmission from electrical domain to optical domain. By using optical waves instead of electrical currents, the system achieves higher bandwidth and immunity to electrical interference. The waveguide structure parameters (dimensions, materials, refractive indices) are optimized to guide optical signals effectively through the semiconductor package.

The patent merges the electrical interconnection structure with optical interconnection structure. The same conductive traces, vias, and interlayer connections that carry electrical signals are designed to also guide optical signals. This is achieved by selecting materials and geometries that support both electrical conductivity and optical waveguiding, thereby eliminating the need for separate optical components and reducing overall device complexity.

The patent creates multi-functional structures that serve both electrical and optical purposes. For example, metal layers are designed with thickness and geometry that provide electrical connectivity while also acting as optical waveguides or reflectors. This universal design allows a single structure to perform multiple functions, reducing the number of components needed and simplifying the overall device architecture.