Plastic Base with Snap-on Fastening for CPU Heat Dissipation

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Solution Overview

Problem

Conventional heat dissipation modules for central processing units face issues such as electrical field interference, increased costs due to additional insulation and glue application, and complex manufacturing/mounting steps, primarily because the metal base used for strength interferes with electrical paths and requires additional components like C-clips for retention.

Innovation Solution

A heat dissipation assembly featuring a base with a snap-on fastening mechanism that snaps into through holes in the central processing unit's substrate, eliminating the need for metal bases and additional insulation, and using high-strength plastic materials with integrated snap-on fastening mechanisms that engage with elongated fasteners to secure the heat radiator, thereby simplifying the mounting process and reducing interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal base is used to provide sufficient strength for stable positioning of the heat dissipation module, then the mechanical strength is improved, but electrical field interference with the circuit board increases

Engineering Contradiction:
Improvemechanical strength of baseVSAvoidelectrical field interference
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the interfering metal base from the system and replaces it with a non-conductive plastic base. The metal base is completely removed and its structural function is transferred to the plastic base through integrated snap-on fastening mechanisms, thereby eliminating electrical field interference while maintaining mechanical strength.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses high-strength plastic material for the base that combines mechanical strength with electrical insulation properties. This composite material solution replaces the traditional metal base structure, providing both the required structural integrity and electrical isolation from the circuit board without requiring additional insulation pieces.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If an insulation piece is added between the metal base and circuit board to avoid short circuits, then electrical interference is reduced, but the number of components and manufacturing complexity increases

Engineering Contradiction:
Improveelectrical interferenceVSAvoidnumber of components
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the base structure and insulation function into a single integrated plastic base component. The snap-on fastening mechanisms are built into the base itself, eliminating the need for separate insulation pieces and reducing the total component count while maintaining electrical isolation and structural support functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The plastic base serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and integrated fastening through the snap-on mechanisms. This multi-functional design eliminates the need for separate insulation pieces and simplifies the overall structure while maintaining all necessary functions.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If C-clips and glue are used to temporarily retain the base on the circuit board during assembly, then the base is securely retained, but the manufacturing and mounting steps become more complex

Engineering Contradiction:
Improveretention stabilityVSAvoidmounting process complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The snap-on fastening mechanisms are self-retaining and do not require external C-clips or glue for assembly. The elastic arms with snap hooks automatically engage with the circuit board holes and lock in place through elastic deformation, providing self-service retention without additional components or complex assembly steps.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The snap-on fastening mechanisms use elastic deformation of the arms to enable dynamic assembly and disassembly. The elastic arms can deform to pass through the circuit board holes and then snap back to lock in place, providing a simple, reversible mechanical retention system that eliminates the need for permanent adhesives or complex clamping mechanisms.

Inventive Principle:
Principle #15Dynamics

4Stability of the object's composition

If a metal base is used to ensure stable positioning, then the heat dissipation stability is improved, but the cost increases due to additional insulation pieces and glue application

Engineering Contradiction:
Improveheat dissipation stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent uses a cost-effective plastic base material that is cheaper than metal while providing sufficient durability for the application. The integrated snap-on fastening mechanism eliminates the need for expensive additional insulation pieces and glue application processes, reducing overall manufacturing costs while maintaining stable heat dissipation positioning.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The high-strength plastic material provides a cost-effective alternative to metal that maintains structural stability for heat dissipation. The material combines adequate mechanical strength with electrical insulation properties, eliminating the need for additional insulation components and reducing overall manufacturing costs while ensuring stable positioning.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces electrical interference, simplifies the mounting process, and lowers costs by eliminating the need for additional insulation and C-clips, while maintaining the necessary strength for stable heat dissipation.

Implementation Method 1

A resilient element 28 is fit over an outer circumference of each threaded fastener 27

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The heat generated by the central processing unit 1 is transferred to the heat radiator 21

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

heat dissipation fan 22 arranged above the heat radiator 21

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS7870888B2Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same
Publication Date: 2011.01.18 ILLINOIS TOOL WORKS INC
  • US7870888B2 patent drawing
  • US7870888B2 patent drawing
  • US7870888B2 patent drawing

AI summary

A heat dissipation assembly for a central processing unit includes a heat radiator adapted to contact the central processing unit from above and a base adapted to support the central processing unit from below. The base includes at least a snap-on fastening mechanism adapted to snap into a through hole formed in a supporting substrate of the central processing unit. The heat radiator includes at least a fastener receiving portion for receiving an elongated fastener and aligning the elongated fastener with a matching engaging element of the snap-on fastening mechanism.