Integrally Molded Plastic Case with Elastic Grounding Arm
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Solution Overview
Problem
Existing electronic devices face issues with electrostatic discharge (ESD) and electric shock due to static electricity, with current solutions like metal cases or conductive cloths/sponges either increasing weight, being costly, or having positioning and tolerance problems.
Innovation Solution
An electronic device design featuring integrally formed plastic supporting members with suspending arms that form a ground circuit when a conductive element presses the first suspending arm, allowing it to contact a second supporting member, providing a flexible and durable solution for ESD protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal case is used to provide ESD protection, then the electrostatic discharge protection is improved, but the weight of the electronic device increases
Solution Approach 1:
The invention divides the grounding function into separate components: a conductive element on the circuit board, a suspending arm structure, and a conductive layer on the case. This segmentation allows the plastic case to remain lightweight while still providing ESD protection through the distributed grounding path formed by these components.
Solution Approach 2:
The invention uses a composite structure combining plastic case material with integrated conductive elements and conductive layers. This allows the case to maintain its lightweight plastic construction while incorporating grounding functionality through the composite of plastic, conductive materials, and suspending arm mechanisms.
2Ease of manufacture
If conductive cloth or conductive sponge is used to form ground circuit, then the manufacturing complexity is reduced, but the positioning precision and tolerance are poor
Solution Approach 1:
The suspending arm is designed as a flexible, elastic component that can dynamically adjust its position and contact pressure. This elasticity allows the arm to accommodate variations in assembly tolerances and positioning deviations, maintaining reliable electrical contact without requiring high precision manufacturing, thus resolving the contradiction between manufacturing simplicity and positioning tolerance.
3Manufacturing precision
If metal spring is used to form ground circuit, then the positioning precision is improved, but the manufacturing cost increases
Solution Approach 1:
The invention changes the material parameter from metal spring to elastic plastic material for the suspending arm. This parameter change maintains the mechanical functionality of positioning and contact while significantly reducing manufacturing cost, as the suspending arm is integrally formed with the plastic case through injection molding rather than requiring separate metal spring components.
4Device complexity
If conductive cloth or conductive sponge is used, then the device complexity is reduced, but the reliability of ground circuit connection deteriorates due to adhesion issues
Solution Approach 1:
The suspending arm is integrally formed with the plastic case as a single molded component, merging the structural support function with the grounding connection function. This eliminates the need for separate adhesive bonding steps and ensures reliable electrical connection through the integral structure, resolving the contradiction between device simplicity and connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively forms a ground circuit, enhancing durability and applicability to various conductive elements, while avoiding the weight and cost issues of metal solutions, and improving positioning and tolerance.
Implementation Method 1
the first supporting member has a first suspending arm... the conductive element is adapted to press the first suspending arm so that the first suspending arm contacts with the second supporting member
Data Source
AI summary
An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.