Plastic and Circuit Component Separation by Selective Solvent Recycling

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Solution Overview

Problem

The integration of plastic and electronic circuit components in products makes recycling challenging, leading to high material loss and environmental impact, necessitating an improved recycling process to separate and reuse these materials effectively.

Innovation Solution

An iterative method involving shredding, solvent mixing, and separation processes to isolate plastic materials and electronic circuit components, allowing for their individual recycling by repeatedly using different solvents to dissolve and recover each plastic type.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If plastic and electronic circuit components are integrated in one product, then product functionality is improved, but material separation and recycling become more difficult

Engineering Contradiction:
Improveproduct functionalityVSAvoidmaterial separation and recycling
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The integrated product is divided into separate components through shredding into small particles, enabling subsequent separation of plastic and electronic circuit components that were previously integrated

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A solvent is introduced as an intermediary substance to selectively dissolve the plastic material, separating it from electronic circuit components through differential solubility

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of substance

If different materials are separated from a mix, then material recovery is improved, but processing complexity increases

Engineering Contradiction:
Improvematerial recoveryVSAvoidprocessing complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

Complex mechanical separation processes are replaced with a chemical dissolution approach using solvents, simplifying the overall processing while achieving effective material separation

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The chemical properties of materials are exploited by changing parameters such as solvent selection and dissolution conditions to achieve separation based on differential solubility characteristics

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively separates and recycles plastic and electronic components with minimal loss, enabling their reuse and reducing environmental impact.

Implementation Method 1

mixing the plurality of shreds and a first solvent to separate the first plastic material from the shreds, thereby obtaining a first solution of the first plastic material in the first solvent

Methodology Applied
Scientific EffectDissolution: Solvation

Data Source

PatentEP4644076A1Separating and recycling of a mix of plastic and electronic circuit components
Publication Date: 2025.11.05 GIESECKE & DEVRIENT EPAYMENTS GMBH
  • EP4644076A1 patent drawingFigure 1~2
  • EP4644076A1 patent drawingFigure 3
  • EP4644076A1 patent drawingFigure 4

AI summary

A method (200) for separating compounds of a body (100) is described. The body (100) includes at least two different compounds. The two different compounds include a first compound which includes a first plastic material (110a-110d), and a second compound which is an electronic circuit component (120). The method (200) includes the following steps: shredding (210) the body (100) into a plurality of shreds (150); mixing (220) the plurality of shreds (150) and a first solvent (315) to separate the first plastic material from the shreds (150), thereby obtaining a first solution (258) of the first plastic material (252) in the first solvent (315), and a first residue (254); separating (230) the first solution (258) from the first residue (254), wherein the first residue (254) includes the electronic circuit component (120); recovering (240) the first plastic material (252) from the first solution (258); and providing (250) the first plastic material (252) and the first residue (254) for separate processing.