Plastic Film Power Semiconductor Packaging Without Die Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional power semiconductor package manufacturing methods are hindered by high costs due to the use of expensive materials like silver paste or silver sintering and face environmental concerns with the use of solder paste.
Innovation Solution
A power semiconductor package unit of surface mount technology (SMT) is developed, which includes a chip with signal contacts on both sides, a plastic film layer with conductive vias, and an electroplated conducting layer that connects the signal contacts without the need for a lead frame or adhesives, reducing manufacturing costs and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silver paste or silver sintering is used for die bonding, then bonding strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive silver paste or silver sintering materials with a low-cost conductive adhesive composition that can be applied as a disposable bonding layer. This conductive adhesive achieves sufficient bonding strength for the application while dramatically reducing material costs, embodying the principle of substituting expensive materials with cheaper alternatives that still fulfill the functional requirements.
Solution Approach 2:
The patent changes the material parameters of the bonding adhesive from traditional silver-based materials to a conductive adhesive composition with different chemical and physical properties. This parameter change allows for cost reduction while maintaining adequate bonding performance through optimized adhesive formulation and application parameters.
2Strength
If solder paste or soft solder is used for die bonding, then bonding strength is improved, but environmental harm increases
Solution Approach 1:
The patent substitutes traditional solder paste or soft solder with a conductive adhesive composition that avoids the environmental issues associated with solder materials. This replacement eliminates harmful substances while providing sufficient bonding strength, aligning with the principle of using alternative materials that are both cost-effective and environmentally friendly.
Solution Approach 2:
The patent converts the potential harm of using traditional solder materials into a benefit by developing a conductive adhesive composition that not only eliminates environmental pollution but also provides adequate bonding performance. This transformation turns a harmful practice into a beneficial, sustainable solution.
3Reliability
If lead frame and adhesives are used for electrical connection, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of the lead frame and bonding adhesives into a single integrated conductive adhesive composition. This composition simultaneously provides electrical conductivity, bonding strength, and structural support, eliminating the need for separate lead frame and adhesive components. This merging reduces device complexity while maintaining reliable electrical connectivity.
Solution Approach 2:
The conductive adhesive composition serves multiple functions simultaneously: it provides electrical conductivity for signal transmission, bonding strength for mechanical attachment, and structural support for the chip. This multi-functionality eliminates the need for separate specialized components, reducing overall device complexity while maintaining all necessary functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the use of expensive materials and adhesives, lowers manufacturing costs, and provides effective electrical connections and heat dissipation pathways while minimizing environmental impact.
Implementation Method 1
wherein the conductive layer in the first via and the conductive layer in the second via are both formed through electroplating
Data Source
AI summary
The present invention includes a chip, a plastic film layer, and an electroplated layer. A front side and a back side of the chip each comprises a signal contact. The plastic film layer covers the chip and includes a first via and a second via. The first via is formed adjacent to the chip, and the second via is formed extending to the signal contact of the front side. A conductive layer is added in the first and the second via. The conductive layer in the second via is electrically connected to the signal contact of the front side. Through the electroplated layer, the signal contact on the back side is electrically connected to the conductive layer in the first via. The conductive layer protrudes from the plastic film layer as conductive terminals. The present invention achieves electrical connection of the chip without using expensive die bonding materials.