Plastic Gene Sequencing Substrate with Protective Metal Oxide Layer

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Solution Overview

Problem

The existing high-throughput sequencing chips with nano wells on glass substrates are costly and complex to manufacture, making them unaffordable for ordinary consumers.

Innovation Solution

A gene sequencing substrate with concave structures on a plastic base substrate, such as PMMA, PDMS, or PET, and a protective metal oxide layer, formed using nanoimprinting or exposure etching processes, which reduces production costs and simplifies the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If nano wells are directly formed on a glass base substrate, then sequencing function is achieved, but manufacturing cost increases and process complexity increases

Engineering Contradiction:
Improvesequencing functionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter of the base substrate from glass to plastic, which fundamentally alters the manufacturing approach. Plastic substrates can be formed using injection molding or extrusion processes that are inherently more cost-effective and scalable than the specialized processes required for glass substrates with nano wells.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a master template with raised structures to imprint concave patterns onto the plastic substrate. This copying approach allows for high-volume production of identical sequencing wells through replication, significantly reducing per-unit manufacturing cost compared to direct formation methods on glass.

Inventive Principle:
Principle #26Copying

2Reliability

If nano wells are directly formed on a glass base substrate, then sequencing function is achieved, but manufacturing process becomes complicated

Engineering Contradiction:
Improvesequencing functionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Changing the substrate material from glass to plastic enables the use of conventional plastic forming processes such as injection molding or extrusion with integrated molding inserts, replacing complex multi-step glass processing procedures with a more streamlined single-step forming operation.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent incorporates the well-forming master template directly into the molding process, creating the concave structures during the initial substrate formation. This preliminary action eliminates subsequent separate steps for creating the sequencing wells, simplifying the overall manufacturing process.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a protective layer is added on the plastic substrate, then chemical resistance is improved, but device structure becomes more complex

Engineering Contradiction:
Improvechemical resistanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a composite structure by depositing a thin protective layer (such as silicon oxide, silicon nitride, or parylene) onto the plastic substrate. This composite approach combines the cost-effective plastic base material with a chemically resistant coating, achieving both low cost and chemical stability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The protective layer is applied specifically to the regions requiring chemical resistance (the concave sequencing wells and flow channels) rather than uniformly across the entire substrate. This localized protection minimizes the added structural complexity while providing necessary chemical resistance where needed.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of a plastic substrate with a protective metal oxide layer for gene sequencing substrates lowers production costs and simplifies the manufacturing process, making high-throughput sequencing more accessible and cost-effective while maintaining sequencing efficiency.

Implementation Method 1

softening the plastic base substrate by heating

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

cooling the base substrate

Methodology Applied
Scientific EffectCooling: Cooling

Implementation Method 3

forming a first protective layer on the base substrate which at least covers the concave structures

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS11708604B2Gene sequencing substrate and method for manufacturing the same, gene sequencing device and gene sequencing method
Publication Date: 2023.07.25 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US11708604B2 patent drawing
  • US11708604B2 patent drawing
  • US11708604B2 patent drawing

AI summary

A gene sequencing substrate and a method for manufacturing the same, and a gene sequencing device are provided. It belongs to the technical field of gene sequencing, and can solve the problem of high cost of the high-throughput sequencing chip in the prior art. The gene sequencing substrate of the present disclosure comprises a plastic material with concave structures as base substrate, and the concave structures serve as reaction cells. Since the base substrate has plasticity, the concave structures can be formed by a simple process to reduce the cost of the gene sequencing substrate. Meanwhile, a first protective layer may be provided on the inner wall of the concave structures for preventing the inner wall of the concave structures from being corroded by the reaction liquid.