Plastic Housing with Metal Shielding Layer for EMI Protection
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Solution Overview
Problem
Plastic housings for semiconductor components fail to shield sensitive structures from electromagnetic interference fields, as plastic materials do not provide effective electromagnetic compatibility, and existing shielding solutions are complex and costly to manufacture.
Innovation Solution
A plastic housing with external faces covered by a closed metal layer, featuring exposed electrically conductive inclusions that are reinforced with a thin initial metal layer and further coated with a thicker metal layer, allowing for adaptable and cost-effective electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic housing materials are used, then manufacturing cost and ease of manufacture are improved, but electromagnetic shielding capability deteriorates
Solution Approach 1:
The patent applies composite materials by combining plastic housing material with metal shielding layers and conductive inclusions. The plastic housing contains metal particles or conductive inclusions mixed into the plastic material, creating a composite structure that maintains the ease of plastic manufacturing while adding electromagnetic shielding properties through the metallic components.
Solution Approach 2:
The patent implements local quality by applying metal shielding layers specifically at critical areas where electromagnetic shielding is needed, such as the outer surface of the housing and areas surrounding sensitive semiconductor structures. This allows the housing to maintain plastic's manufacturing advantages while providing targeted shielding where required.
2Object-affected harmful factors
If shielding films are arranged within plastic housing composition, then electromagnetic shielding capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the shielding function with the housing structure itself by incorporating conductive inclusions directly into the plastic housing material and applying metal layers to the housing surface. This integration eliminates the need for separate shielding films and their complex geometric adaptation, simplifying both device structure and manufacturing process.
Solution Approach 2:
The patent extracts the shielding function from separate geometrically-adapted films and integrates it into the housing material and surface treatment. By taking out the complex film arrangement requirement and replacing it with bulk conductive inclusions and surface metal layers, the device complexity is reduced while maintaining shielding effectiveness.
3Object-affected harmful factors
If a closed metal layer is applied over plastic external faces, then electromagnetic shielding capability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by incorporating conductive inclusions into the plastic housing material before the housing is formed, and by applying metal layers to the external faces during the manufacturing process. This preliminary preparation of conductive elements simplifies subsequent shielding implementation, as the foundation for electromagnetic shielding is already in place during housing fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable protection against electromagnetic interference, enabling semiconductor components to meet electromagnetic compatibility standards while allowing for varied plastic housing geometries and cost-effective manufacturing.
Implementation Method 1
plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer comprises exposed electrically conductive inclusions of the plastic of the housing
Implementation Method 2
the boundary layer between plastic external faces and the closed metal layer comprises exposed electrically conductive inclusions of the plastic of the housing
Data Source
AI summary
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.