Plastic Housing Microstimulator RF Transparency and Sealing
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Solution Overview
Problem
Existing implantable microstimulators with metal or ceramic housings require complex and costly brazing processes, and their inability to efficiently transmit RF signals for charging and data communication limits their functionality and manufacturing efficiency.
Innovation Solution
An implantable microstimulator with a plastic housing and exposed electrodes that forms a hermetically sealed structure, allowing for easier and less costly manufacturing, and enhanced RF signal permeability for charging and data communication, using a hydrophobic polymer material with optional coatings and conductive electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal or ceramic housings are used for implantable microstimulators, then hermetic sealing is achieved, but manufacturing complexity and cost increase due to brazing processes
Solution Approach 1:
The patent changes the material parameter from metal/ceramic to biocompatible plastic, which fundamentally alters the sealing approach from brazing to ultrasonic welding or adhesive bonding, thereby simplifying manufacturing while maintaining hermeticity
Solution Approach 2:
The patent replaces the mechanical brazing process with ultrasonic welding or adhesive bonding, substituting a complex thermal-mechanical joining method with a simpler acoustic or chemical bonding mechanism
2Strength
If metal or ceramic housings are used for implantable microstimulators, then structural strength is maintained, but RF signal transmission for charging and data communication is blocked
Solution Approach 1:
The patent changes the material's electromagnetic parameter from conductive (metal) or highly reflective (ceramic) to dielectric with appropriate permittivity (plastic), enabling RF signal penetration while maintaining structural integrity through molecular bond strength
Solution Approach 2:
The plastic housing acts as an intermediary material that allows RF signals to pass through while still providing mechanical protection, serving as both a structural component and an electromagnetic transparent window
3Reliability
If brazing processes are used for metal and ceramic components, then hermetic sealing is achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent replaces the slow, multi-step brazing process with rapid ultrasonic welding or adhesive bonding, substituting a time-intensive thermal process with a faster acoustic or chemical bonding method that reduces cycle time
Solution Approach 2:
The patent adopts a disposable-like manufacturing approach where the housing is molded as a ready-to-use component requiring minimal assembly, similar to how disposable components are pre-prepared and simply installed, thereby streamlining production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plastic housing microstimulator reduces manufacturing time and costs, provides a more efficient means of charging and data communication through improved RF signal transparency, and maintains a hermetically sealed environment for the electronic components.
Implementation Method 1
one of the major disadvantages of the metal and ceramic microstimulators is their inability to transmit RF signals through the housing for charging and data communication
Implementation Method 2
The housing is formed of a hydrophobic polymer material
Data Source
AI summary
An implantable microstimulator includes a plastic housing having a first end and a second end; an electronic subassembly disposed within the housing; a first electrode disposed at the first end of the plastic housing and in electrical communication with the electronic subassembly; and a second electrode disposed at the second end of the plastic housing and in electrical communication with the electronic subassembly. The plastic housing, first electrode, and second electrode form a hermetically sealed structure around the electronic subassembly.


