Plastic Splice Housing With In-Mould EMC Film Bonding

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Solution Overview

Problem

Existing methods for providing electromagnetic shielding in plastic housings are labor-intensive, costly, and lack durability, especially when applied to complex three-dimensional shapes, and often require multiple steps and post-moulding applications.

Innovation Solution

Integrate an electrically conductive film during the injection moulding process, ensuring the film conforms to the mould's 3D contours, and optionally preform it to match the final product shape, using an in-mould-label with aluminum and specific thickness for optimal conductivity and structural integrity, and incorporate fixation means like teeth for a strong bond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional post-moulding conductive coatings are applied to plastic housings, then electromagnetic shielding is achieved, but the process becomes labor-intensive and time-consuming

Engineering Contradiction:
Improveelectromagnetic shieldingVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent combines the conductive coating application with the injection moulding process by integrating a conductive foil into the mould cavity. The foil is embedded in the mould and bonds with the plastic material during injection, eliminating the need for separate post-moulding coating steps and achieving both structural formation and EMI shielding simultaneously

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive foil is pre-positioned within the mould cavity before the injection moulding process begins. This preliminary placement ensures that the shielding layer is already in position to receive the plastic material, allowing the bonding to occur during the standard moulding cycle without requiring additional post-processing steps

Inventive Principle:
Principle #10Preliminary action

2Reliability

If traditional conductive coatings are applied after moulding, then electromagnetic shielding is provided, but the bond strength and durability are insufficient

Engineering Contradiction:
Improveelectromagnetic shieldingVSAvoidbond strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent merges the conductive layer integration with the injection moulding process itself. The plastic material bonds directly to the conductive foil during moulding under heat and pressure, creating a strong mechanical and chemical bond that is inherent to the structural formation process rather than a superficial post-application coating

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent creates a composite structure where the plastic housing material and conductive foil are bonded together as an integrated unit. This composite approach combines the structural properties of plastic with the conductive properties of the foil, achieving both mechanical strength and electromagnetic shielding in a single durable component

Inventive Principle:
Principle #40Composite materials

3Reliability

If conductive material is applied to complex three-dimensional shapes, then electromagnetic shielding coverage is attempted, but uniform and complete coverage is difficult to achieve

Engineering Contradiction:
Improveelectromagnetic shielding coverageVSAvoidcoverage uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent adapts the conductive shielding layer to complex three-dimensional contours by using a flexible conductive foil that can conform to curved and irregular surfaces. The foil is positioned within the mould cavity to match the desired three-dimensional shape, ensuring that the shielding layer follows the exact contours of the housing regardless of geometric complexity

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The injection moulding process itself provides the uniform distribution and complete coverage by injecting plastic material that fills the entire mould cavity and bonds to the conductive foil. This ensures that every surface area, including complex three-dimensional contours, receives uniform coverage as the molten plastic flows to fill all cavities and bonds to the pre-positioned foil

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method results in robust, durable, and efficient electromagnetic shielding with reduced manufacturing time and costs, ensuring complete coverage and consistent performance, suitable for complex electronic devices and automotive components.

Implementation Method 1

injection moulding plastic into the mould so that the injected plastic bonds with the electrically conductive film

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentEP4696481A1Plastic splice with embossed EMC layer
Publication Date: 2026.02.18 APTIV MANUFACTURING MANAGEMENT SERVICES GMBH
  • EP4696481A1 patent drawingFigure 1~2C)
  • EP4696481A1 patent drawingFigure 3
  • EP4696481A1 patent drawing

AI summary

A method of providing an electrically conductive layer to a plastic housing, in particular a splice housing for electromagnetically shielded cable harnesses, comprises the steps of: a) providing an electrically conductive film and a mould; b) inserting the film in the mould; c) injection moulding plastic into the mould so that the injected plastic bonds with the electrically conductive film.