Plastic Substrate Liquid Crystal Display for Flexible Lightweight Design
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Solution Overview
Problem
Conventional liquid crystal display devices face limitations in reducing thickness and increasing flexibility due to the use of glass substrates, which are fragile and require high-temperature processing, making it difficult to create flexible and lightweight displays.
Innovation Solution
The use of plastic substrates for the liquid crystal display device, where one or both substrates are formed with a silicon layer and a thin film transistor circuit, and a wiring connection portion, with adhesives and a seal agent to sandwich a liquid crystal layer, allowing for the replacement of glass substrates and enabling flexibility and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass substrates are used for TFT substrate and opposite substrate, then heat resistance and low heat expansion coefficient are achieved, but thickness reduction and flexibility are limited due to fragility
Solution Approach 1:
The invention changes the material parameter from glass to plastic substrate, which has different thermal and mechanical properties. The plastic substrate cannot withstand high-temperature processes, so the manufacturing process parameters are also changed to avoid high temperatures, enabling flexibility while accepting the material substitution
Solution Approach 2:
The invention uses a composite structure where a plastic substrate is combined with a semiconductor thin film and other functional layers. This composite approach allows the plastic substrate to provide flexibility while the thin film layers provide the necessary electronic functionality, resolving the contradiction between substrate flexibility and device performance
2Ease of manufacture
If glass substrates are used to enable high temperature process for TFT formation, then semiconductor thin film can be formed, but substrate thickness cannot be reduced below certain limit due to fragility
Solution Approach 1:
The invention changes the manufacturing temperature parameter from high temperature (required for glass substrates) to low temperature (compatible with plastic substrates). This parameter change enables the use of plastic substrates which can be made thinner without breaking, thus reducing substrate thickness while still allowing semiconductor thin film formation through low-temperature processes
3Ease of operation
If plastic substrate is used to achieve flexibility and weight reduction, then substrate can be freely bent and lightweight, but high temperature process for semiconductor film formation cannot be applied
Solution Approach 1:
The invention changes the temperature parameter of the semiconductor fabrication process from high temperature to low temperature, making it compatible with plastic substrates. This allows the plastic substrate to maintain its flexibility and lightweight properties while still enabling semiconductor thin film formation through modified manufacturing parameters
Solution Approach 2:
The invention replaces the conventional high-temperature thermal processing method with a low-temperature processing method that is compatible with plastic substrates. This substitution of the heating mechanism allows plastic substrates to be used while still forming functional semiconductor thin films
Data Source
AI summary
A liquid crystal display device includes a first substrate and a second substrate which sandwiches a liquid crystal between itself and the first substrate, wherein the first substrate has thin film transistors and a wiring connection portion in which are formed terminals connected to the thin film transistors, a wiring substrate connected to the terminals is disposed in the wiring connection portion, the second substrate is a plastic substrate, and has an adhesive layer and an inorganic insulating layer formed on top of the adhesive layer, and the adhesive layer covers the wiring connection portion and one portion of the wiring substrate.