Plastic Waveguide RF Signal Transmission in IC Packages

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Solution Overview

Problem

High frequency RF signals experience significant power loss when transported outside of a chip or package, particularly in high gigahertz range applications, due to the concentration of signals within plastic waveguides and reduced isolation distances, which affects the efficiency of high frequency transmissions.

Innovation Solution

The integration of a plastic waveguide with a semiconductor chip and an embedded antenna in an IC package, where the waveguide acts as a high pass filter for RF signals, and the use of supporting structures like spherical resonators or waveguide cages to minimize power loss by optimizing signal transmission and reflection within the waveguide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If RF signals are transported outside of chip/package using plastic waveguide, then signal transmission capability is improved, but power loss increases significantly in high gigahertz range

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidpower loss
Core Design Contradiction:
SpeedVSLoss of energy

Solution Approach 1:

The patent introduces an embedded antenna as an intermediary component between the IC chip and the external plastic waveguide. The antenna serves as a coupling mechanism that efficiently transfers RF signals from the chip's transmission line to the waveguide, minimizing power loss at the interface. This intermediary structure resolves the contradiction by providing optimal impedance matching and signal coupling, enabling both high-speed transmission and low power loss in the high gigahertz range.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If plastic waveguide is used for high frequency transmission, then isolation distance reduces and bending losses decay, but output power loss becomes critical performance parameter

Engineering Contradiction:
Improveisolation distance reductionVSAvoidoutput power loss
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent optimizes the physical parameters of the plastic waveguide, including its dimensions, material properties, and coupling geometry with the embedded antenna. By carefully selecting the waveguide's cross-sectional dimensions and the antenna's position and orientation, the system achieves reduced isolation distance and minimized bending losses while maintaining low output power loss. This parameter optimization allows the waveguide to efficiently handle high frequency signals in the high gigahertz range.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces power loss and enhances high frequency signal transmission efficiency by utilizing the waveguide's high pass filtering properties and strategic placement to manage signal direction and reflection, thereby improving the performance of high frequency components.

Implementation Method 1

A waveguide is a device that transports Radio Frequency (RF) signals from one location to another

Methodology Applied
Scientific EffectWaveguide: Waveguide

Implementation Method 2

The waveguide acts as a high pass filter in that signal frequencies above a cutoff frequency pass through the waveguide, whereas signal frequencies below are attenuated

Methodology Applied
Scientific EffectHigh pass filtering: Filter (electronic)

Implementation Method 3

an embedded antenna configured as a feeding port to the plastic waveguide

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS11387533B2Semiconductor package with plastic waveguide
Publication Date: 2022.07.12 INFINEON TECHNOLOGIES AG
  • US11387533B2 patent drawing
  • US11387533B2 patent drawing
  • US11387533B2 patent drawing

AI summary

A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.