Plate-Shaped Copper Paste for Dense Sintered Bonding Layers
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Solution Overview
Problem
Existing electrically conductive pastes with spherical copper oxide particles suffer from low denseness, bonding strength, and reliability due to vacancies in the bonding layer during sintering.
Innovation Solution
The use of plate-shaped copper particles containing Cu, Cu2O, and Cu64O with a specific content range of Cu64O (2.1 to 25.0 mass %) enhances sinterability and reducibility, leading to a bonding layer with high denseness, strength, and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spherical copper oxide particles are used in paste composition, then the paste can be easily manufactured, but the bonding layer has low denseness and low bonding strength due to vacancies during sintering
Solution Approach 1:
The patent applies the inverse of the spherical shape principle by using plate-shaped (flaky) copper particles instead of spherical ones. This shape change allows particles to pack more densely and reduce vacancies during sintering, thereby improving bonding strength while maintaining ease of manufacture through conventional paste preparation methods.
Solution Approach 2:
The patent changes the geometric parameter of the copper particles from spherical to plate-shaped, and controls the oxide content within 5 mass% or less. This parameter change improves particle packing density and reduces vacancies in the bonding layer, leading to higher bonding strength without compromising manufacturability.
2Ease of manufacture
If spherical copper oxide particles are used in paste composition, then the paste can be easily manufactured, but the bonding layer has low denseness due to vacancies during sintering
Solution Approach 1:
The patent uses plate-shaped copper particles instead of spherical ones to improve packing density. The flaky morphology allows particles to stack more efficiently and reduce void spaces during sintering, achieving higher denseness (improved quantity of substance) while maintaining ease of manufacture.
Solution Approach 2:
The patent changes the geometric parameters of copper particles to plate-shaped morphology and controls oxide content to 5 mass% or less. This parameter optimization improves particle packing efficiency and reduces vacancies, resulting in higher bonding layer denseness without affecting manufacturability.
3Strength
If sintering is performed to form bonding layer, then bonding strength is improved, but vacancies remain in the bonding layer reducing reliability
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: using plate-shaped copper particles with specific morphology, controlling oxide content to 5 mass% or less, and adjusting particle size distribution. These parameter changes enable more complete sintering with fewer vacancies, improving both bonding strength and reliability.
Solution Approach 2:
The patent uses a composite structure of copper particles with controlled oxide content (5 mass% or less). The combination of reduced oxide content and plate-shaped morphology creates a composite material that sinters more effectively, eliminating vacancies and improving both strength and reliability of the bonding layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plate-shaped copper particles form a bonding layer with improved denseness, bonding strength, and reliability, stabilizing the operability of semiconductor and electronic components by effective heat dissipation.
Implementation Method 1
when bonding is performed by sintering, there is a possibility that vacancies are generated in the bonding layer
Implementation Method 2
The use of plate-shaped copper particles containing Cu, Cu2O, and Cu64O with a specific content range of Cu64O (2.1 to 25.0 mass %) enhances sinterability and reducibility
Implementation Method 3
A countermeasure for obtaining stable operability is adopted, for example, in which a heat generating member such as a semiconductor element and a heat dissipating member are bonded to each other with a highly thermally conductive adhesive (paste), whereby heat is dissipated
Data Source
AI summary
Provided are an oxide-containing plate-shaped copper particle that can provide a paste composition capable of forming a bonding layer having high denseness, high bonding strength, and high bonding reliability, a paste composition using the same, and a semiconductor device, an electrical component, and an electronic component. The copper oxide-containing plate-shaped copper particle of the present disclosure contains Cu, Cu2O, and Cu64O, wherein a content of Cu64O is from 2.1 to 25.0 mass % relative to 100 mass % of a total content of Cu, Cu2O, and Cu64O.