Plate element for surface heating and cooling with heating or cooling register
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Solution Overview
Problem
Existing panel elements for surface heating or cooling in building interiors face inadequate heat transfer to base plates due to non-flat shapes, leading to reduced heating or cooling performance and increased energy consumption.
Innovation Solution
A panel element with a metallic base plate having a three-dimensional uneven shape and a heat-conducting layer that corresponds to the base plate's uneven shape, ensuring a positive interlocking and continuous bond for improved heat transfer, achieved through compressible or pre-formed materials that adapt to the base plate's structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a non-flat base plate is used for panel elements, then manufacturing flexibility and design versatility are improved, but heat transfer to the base plate deteriorates due to point contact only
Solution Approach 1:
A heat-conducting layer is introduced as an intermediary component between the register and the non-flat base plate. This layer compensates for surface irregularities and ensures continuous thermal contact, resolving the contradiction between design versatility and heat transfer efficiency.
Solution Approach 2:
The patent changes the physical state or properties of the heat-conducting layer (using compressible or adaptive materials) to enable it to conform to the non-flat base plate surface, thereby maintaining thermal contact despite surface irregularities.
2Loss of energy
If specially shaped heat-conducting profiles are installed between the register and base plate, then heat transfer is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of using complex pre-shaped profiles, the patent employs materials with specific physical properties (compressibility, adaptability) that allow a simpler layer structure to achieve the same heat transfer function, reducing manufacturing complexity.
Solution Approach 2:
The heat-conducting layer uses composite material properties combining thermal conductivity with mechanical adaptability, achieving both heat transfer efficiency and surface compensation without complex geometries.
3Volume of moving object
If three-dimensionally shaped and nested panel elements are used, then space utilization and design flexibility are improved, but sufficient heat transfer to the interior side becomes inadequate
Solution Approach 1:
The heat-conducting layer serves as a mediator that bridges the gap created by three-dimensional shaping, ensuring thermal contact is maintained even when the base plate has complex spatial geometry.
Solution Approach 2:
The solution addresses the three-dimensional challenge by introducing a layer that operates in the thermal dimension, compensating for geometric complexities through material properties rather than additional structural dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency, reduces energy consumption, and maintains a compact design with improved acoustic properties and versatility in shape adaptation without additional structural measures.
Implementation Method 1
heat-conducting layer between the base plate and the register for heat transfer between the register and the base plate
Implementation Method 2
achieved through compressible or pre-formed materials that adapt to the base plate's structure
Implementation Method 3
compressible or pre-formed materials that adapt to the base plate's structure
Data Source
Figure 1a~2b
Figure 3a~3c
Figure 4a~4c
AI summary
A panel element (10) for surface heating or cooling of ceilings or walls of building interiors, comprising a metallic base plate (1) facing the interior and a register (2) directly or indirectly connected thereto for a heating or cooling medium flowing through the register (2), and comprising at least one heat-conducting layer (3) between the base plate (1) and the register (2) for heat transfer between the register (2) and the base plate (1), wherein the base plate (1) has a three-dimensional, uneven shape in its surface area and the heat-conducting layer (3) has, on the side facing the base plate (1), a counter-shape corresponding to the uneven shape of the base plate (1) for a positive interlocking and continuous surface bonding of the heat-conducting layer (3) to the base plate (1) together with the register (2) for heating or cooling, or forms such a bond in the assembly of the base plate (1) and the heat-conducting layer (3).