Plate Heat Exchanger Brazing with Graded Solder Layers

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Solution Overview

Problem

The existing plate heat exchangers face long soldering times and potential erosion issues due to the formation of low-melting Al-Si eutectics, which can lead to reduced bursting pressures and size limitations in heat exchanger designs, especially in larger constructions.

Innovation Solution

The plate heat exchanger employs solder layers on separating plates with varying alloy compositions to create a temperature gradient, allowing all solder areas to melt simultaneously, reducing soldering time and preventing the formation of low-melting Al-Si eutectics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single aluminum solder alloy with narrow and high melting range is used, then reliable brazing of components is achieved, but soldering time becomes excessively long and low-melting-point Al-Si eutectics form causing erosion

Engineering Contradiction:
Improvebrazing reliabilityVSAvoidsoldering time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The solder layer is segmented into multiple zones with different alloy compositions along the thickness direction. The first solder zone (near the baffle) has higher silicon content (5-13 wt%) and lower melting point, while the second solder zone (near the heating element) has lower silicon content (0-5 wt%) and higher melting point. This segmentation allows each zone to melt at different times during brazing, enabling the overall soldering process to be completed in a shorter time while preventing harmful eutectic formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the solder layer are given different local compositions tailored to their specific functional requirements. The first solder zone closer to the baffle is designed with composition optimized for initial bonding and lower temperature operation, while the second solder zone closer to the heating element is designed for high-temperature strength and erosion resistance. This local quality differentiation resolves the contradiction between reliable brazing and short soldering time.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the heat exchanger block is heated uniformly, then all components reach the same temperature, but the edge solder remains molten for several hours while core solder melts in minutes

Engineering Contradiction:
Improvetemperature uniformityVSAvoidproduction efficiency
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The solder layer is pre-configured with a gradient composition before brazing begins. The first solder zone with lower melting point is positioned to melt first and establish initial bonding, while the second solder zone with higher melting point is positioned to complete the bonding as temperature increases. This preliminary arrangement of different melting points throughout the solder layer thickness allows the brazing process to proceed efficiently without requiring excessively long heating times to maintain uniform temperature.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The melting point parameter of the solder is changed through compositional variation across the solder layer thickness. By creating a gradient in silicon content (and thus melting point) from the first solder zone to the second solder zone, the invention enables controlled sequential melting that maintains temperature stability while dramatically reducing total brazing time, thereby improving production efficiency.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If long soldering times are used to ensure complete melting, then brazing reliability improves, but erosion and hole formation occur due to Al-Si eutectic formation

Engineering Contradiction:
Improvebrazing completenessVSAvoiderosion and hole formation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The solder layer is divided into two distinct zones with different alloy compositions. The first solder zone contains 5-13 wt% Si and melts at lower temperature to provide initial bonding, while the second solder zone contains 0-5 wt% Si and melts at higher temperature to complete the bonding. This segmentation ensures complete brazing reliability while limiting the time each zone remains in a molten state, preventing harmful Al-Si eutectic formation and subsequent erosion.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The second solder zone near the heating element is specifically designed with lower silicon content (0-5 wt%) to resist erosion and prevent hole formation in critical areas. This local compositional optimization ensures that the region most susceptible to thermal stress and chemical reactions has enhanced durability, eliminating the harmful effects of prolonged molten state while maintaining overall brazing reliability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach shortens soldering times and enhances bursting pressures, eliminating size limitations and erosion issues, thereby improving the design and operational efficiency of the heat exchanger.

Implementation Method 1

the brazing alloy layers comprise at least two brazing alloy regions that differ from one another in their alloy composition... all solder zones melt simultaneously

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

the heat exchanger block heats up slowly from its edge to its core in the brazing furnace

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP4041473B1Plate heat exchanger, processing system and method of manufacture
Publication Date: 2023.08.23 LINDE AG

AI summary

The invention relates to a plate heat exchanger (1) for a process engineering plant (27), comprising a heat exchanger block (2) which has a plurality of alternatingly arranged heating surface elements (3) and separating plates (4), wherein the separating plates (4) are soldered to the heating surface elements (3) with the aid of solder layers (32) provided at the separating plates (4), and wherein, in at least a part of the separating plates (4), the solder layers (32) comprise at least two soldered areas (35-37) that differ in terms of the alloy composition thereof.