Plate gas heater

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Solution Overview

Problem

Current process gas heaters have limitations such as limited upper temperature capability and difficulties in replacing heating rods, which restrict their effectiveness in high-temperature semiconductor processing applications.

Innovation Solution

The design includes a heating unit with a base plate and a cover plate forming a gas-flow conduit, where sets of heaters on both sides efficiently heat the gas flowing through, allowing for high-temperature heating of process gases with improved structural rigidity and heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional heating rods are used in process gas heaters, then heating function is provided, but upper temperature capability is limited and heating rods are difficult to replace

Engineering Contradiction:

Improveupper temperature capabilityVSAvoiddifficulty in replacing heating rods

Core Design Contradiction:

TemperatureVSEase of repair

Solution Approach 1:

The heater is divided into modular components including a base plate with passage, cover plate, and removable heating elements. The heating elements can be independently accessed and replaced by removing the cover plate, enabling easy maintenance while achieving high temperature capability through optimized material selection and structural design of each segment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent changes the physical and material parameters of the heating system by using high-temperature resistant materials for the base plate and cover plate, and by designing heating elements with improved thermal conductivity and temperature stability. These parameter changes enable the system to achieve higher upper temperature capabilities while maintaining ease of replacement.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If heating units are designed for high temperature processing, then temperature capability is improved, but heat loss increases and structural integrity may be compromised

Engineering Contradiction:

Improveheating temperatureVSAvoidheat loss

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The base plate and cover plate are merged into an integrated enclosure that surrounds the heating elements and gas passage. This merging creates a thermally efficient chamber that minimizes heat loss to the environment while maintaining structural integrity at high temperatures through the use of thermally stable materials and rigid structural design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent converts the potential harm of heat loss by designing the base plate and cover plate with thermal insulation properties and heat reflection surfaces. The heat that would otherwise be lost is redirected back into the gas stream, improving thermal efficiency while maintaining the high temperature capability needed for semiconductor processing.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Manufacturing precision

If heating elements are placed on both sides of the base plate, then heating uniformity is improved, but device complexity increases

Engineering Contradiction:

Improveheating uniformityVSAvoidheater structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

While heating elements are placed on both sides of the base plate for uniform heating, the cover plate design incorporates asymmetric features including a defined gas flow conduit with specific inlet and outlet positions. This asymmetric conduit design simplifies gas flow management and reduces overall device complexity despite the symmetric heating arrangement.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The base plate serves multiple functions: it provides structural support, contains the heating elements on both sides for uniform heating, and forms part of the gas flow conduit system. This multi-functionality reduces the need for additional separate components, thereby reducing device complexity while maintaining heating uniformity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables uniform heating of gases to high temperatures, such as 650°C, while maintaining structural integrity and minimizing heat loss, thus addressing the limitations of existing heaters in semiconductor processing.

Implementation Method 1

a first set of heaters may be disposed on the second side of the base plate, and a second set of heaters may be disposed on the fourth side of the cover plate

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

The third side of the cover plate may be disposed on the first side of the base plate. A gas-flow conduit may be defined by the base plate and the third side of the cover plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240153793A1Plate gas heater

Publication Date: 2024.05.09 YIELD ENG SPV LLC

AI summary

A heating unit includes a base plate and a cover plate. A passage extends through base plate such that a conduit is defined between base plate and cover plate. A first set of heaters is disposed on a side of base plate opposite passage and a second set of heaters is disposed on a side of cover plate opposite passage.