Plate Heat Exchanger Assembly Without Soldering or Flux
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Solution Overview
Problem
The existing methods for manufacturing plate-shaped heat exchangers are costly and require chemical pre-treatment and high energy for soldering, making them inefficient.
Innovation Solution
A method involving the application of an adhesive strip to panel elements, forming a cavity, and hydroforming to create a fluid channel without the need for chemical pre-treatment or high-temperature soldering, reducing manufacturing costs and energy requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering method is used to manufacture heat exchanger, then connection strength is improved, but manufacturing cost and energy consumption increase
Solution Approach 1:
The invention changes the bonding parameters from thermal-soldering to adhesive bonding at room temperature or moderate temperatures. The adhesive strip is applied to plate elements and cured to form strong bonds without requiring high-temperature heating equipment, thus reducing energy consumption while maintaining connection strength.
Solution Approach 2:
The invention replaces the thermal-soldering process with a chemical-adhesive bonding process. Instead of using heat and molten solder to create joints, the patent uses adhesive strips that are applied and cured to bond plate elements, eliminating the need for high-temperature heating systems.
2Strength
If soldering method is used to manufacture heat exchanger, then connection strength is improved, but manufacturing complexity increases
Solution Approach 1:
The adhesive strip is applied to the plate elements in advance before assembly. This preliminary application of adhesive simplifies the manufacturing process by eliminating the need for on-site soldering operations, reducing manufacturing complexity while ensuring strong connections upon assembly.
Solution Approach 2:
The invention extracts and eliminates the complex soldering process from the manufacturing sequence. By using pre-applied adhesive strips, the patent removes the need for flux application, heating equipment, and soldering operations, significantly reducing manufacturing complexity.
3Manufacturing precision
If chemical pre-treatment with flux is applied, then soldering quality is improved, but manufacturing cost and environmental impact increase
Solution Approach 1:
The invention completely removes the chemical pre-treatment step involving flux from the manufacturing process. By using adhesive bonding instead of soldering, there is no need for chemical flux application, rinsing, or disposal, eliminating harmful chemical waste while maintaining bonding quality.
Solution Approach 2:
The adhesive strip serves as a disposable bonding element that is applied and cured without requiring any chemical preparation or cleanup. This eliminates the need for expensive chemical flux and the associated waste treatment, reducing both cost and environmental impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of a heat exchanger with reduced manufacturing effort and energy consumption, eliminating the need for chemical pre-treatment and high-temperature processing, thereby lowering costs and improving efficiency.
Implementation Method 1
Applying an adhesive strip to a first plate element, in particular to a second surface area of the first plate element
Implementation Method 2
the first surface area, the second plate element and the adhesive strip together define a cavity of the assembly which is accessible through a fluid inlet
Data Source
Figure 1~2
Figure 3~10
Figure 4
AI summary
A method for manufacturing a heat exchanger, particularly for a motor vehicle, comprising the steps of: applying an adhesive strip to a first plate element, wherein the adhesive strip encloses a first surface area of the first plate element, and attaching a second plate element to the adhesive strip; curing the adhesive strip, whereby an assembly is formed, wherein the first surface area, the second plate element, and the adhesive strip together define a cavity accessible through a fluid inlet of the first or second plate element; receiving the assembly in a mold; and internal high-pressure forming of the assembly with the application of an overpressure to the fluid inlet, whereby the cavity is configured as a fluid channel for guiding a temperature control medium.