Semiconductor Plate Heater Control for In-Plane Temperature Uniformity
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Solution Overview
Problem
Existing silicon heaters struggle to adjust in-plane temperature distribution after fabrication, leading to difficulties in achieving desired uniformity and high manufacturing costs due to complex wiring or expensive impurity concentration adjustments.
Innovation Solution
A heater configuration with a single plate-shaped semiconductor substrate and multiple electrodes on its side surface, allowing current to be conducted between electrodes while sequentially switching sets of electrodes, with controlled conducting time periods to adjust temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex wiring or impurity concentration adjustments are used to adjust in-plane temperature distribution, then temperature uniformity is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The heater is divided into multiple independent heating regions, each controlled by a separate electrode. By selectively activating specific electrodes, different regions of the heater can be heated independently, enabling precise control of in-plane temperature distribution without complex wiring throughout the entire structure.
Solution Approach 2:
The heater employs dynamic control through sequential switching of electrodes at different conducting time periods. This dynamic approach allows the temperature distribution to be adjusted in real-time during operation, achieving desired in-plane uniformity through temporal control rather than static complex wiring or material adjustments.
2Manufacturing precision
If complex wiring or impurity concentration adjustments are used to adjust in-plane temperature distribution, then temperature uniformity is improved, but manufacturing cost increases
Solution Approach 1:
The heater is divided into multiple independent heating regions, each controlled by a separate electrode. By selectively activating specific electrodes, different regions of the heater can be heated independently, enabling precise control of in-plane temperature distribution without complex wiring throughout the entire structure.
Solution Approach 2:
The heater employs dynamic control through sequential switching of electrodes at different conducting time periods. This dynamic approach allows the temperature distribution to be adjusted in real-time during operation, achieving desired in-plane uniformity through temporal control rather than static complex wiring or material adjustments.
3Manufacturing precision
If uniform heating is achieved through conventional methods, then temperature distribution is improved, but ease of operation deteriorates due to adjustment difficulties
Solution Approach 1:
The heater employs dynamic control through sequential switching of electrodes at different conducting time periods. This dynamic approach allows the temperature distribution to be adjusted in real-time during operation, achieving desired in-plane uniformity through temporal control rather than static complex wiring or material adjustments.
Solution Approach 2:
The heater controls temperature distribution by changing the conducting time periods of different electrodes. By adjusting the duration for which each electrode conducts current, the system can precisely control the heat input to each region, enabling easy adjustment of in-plane temperature distribution through parameter control rather than physical reconfiguration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and cost-effective achievement of desired in-plane temperature distribution by adjusting heating amounts through electrode switching and time period settings, facilitating efficient manufacturing and uniform heating.
Implementation Method 1
heating the plate-shaped member by conducting current between the electrodes
Data Source
AI summary
Disclosed is a method for controlling the temperature of a heater which has a single plate-shaped member formed of a semiconductor substrate, and three or more electrodes formed on a side surface of the single plate-shaped member while being spaced apart from each other in a circumference direction, the method comprising a step for heating the plate-shaped member by supplying a power between the electrodes and sequentially changing the pair of electrodes to which the power is supplied, wherein a period of time in which the power is supplied between the electrodes in the heating step is individually determined for each set of electrodes.


