Plate Package Fluid Distribution via Post-Assembly Thermal Holes
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Solution Overview
Problem
Existing plate heat exchangers face challenges in achieving even fluid distribution across evaporation flow paths, leading to inefficient use of the heat exchanger, overheating, and the risk of liquid entering the compressor, due to the complexity of manufacturing and positioning restriction means such as rings, washers, or folded plate edges.
Innovation Solution
A plate package design where heat exchanger plates are joined with peripheral rims that form an inlet channel, and through holes are created post-assembly using thermal processes like laser, electron beam, or plasma, allowing for optimized fluid distribution based on computer simulations and flexibility in hole placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If restriction means (rings, washers, or folded plate edges) are arranged in passages to control fluid distribution, then fluid distribution is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the restriction means directly into the heat transfer plates by forming protrusions that extend into the passages. This integration eliminates the need for separate rings or washers, reducing assembly steps and manufacturing complexity while maintaining fluid distribution control.
Solution Approach 2:
The protrusions are pre-formed as integral parts of the heat transfer plates during plate manufacturing. This preliminary action ensures correct positioning and eliminates the need for separate installation steps, reducing manufacturing complexity while achieving the desired fluid distribution control.
2Manufacturing precision
If separate rings or washers are used as restriction means, then fluid distribution is improved, but positioning accuracy and assembly difficulty worsen
Solution Approach 1:
The restriction means are merged into the heat transfer plates as integral protrusions. This eliminates positioning errors associated with separate components, ensuring precise and consistent placement without requiring separate positioning adjustments during assembly.
3Manufacturing precision
If pipe with multiple holes is used as restriction means, then fluid distribution is improved, but device complexity and length requirements increase
Solution Approach 1:
The patent integrates the restriction function directly into the heat transfer plates through protrusions, eliminating the need for separate pipe components with multiple holes. This reduces device complexity while maintaining the ability to control fluid distribution to multiple passages.
4Device complexity
If folding of plate edge portions is used to create restriction means, then device complexity is reduced, but manufacturing precision and inlet opening definition worsen
Solution Approach 1:
The plate edge is segmented into multiple protrusions that extend into the passages. This segmentation provides well-defined inlet openings for each passage while maintaining a relatively simple overall structure, achieving both manufacturing precision and low device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient, even fluid distribution, reduces manufacturing complexity, and allows for customization to specific customer needs, ensuring effective use of the heat exchanger surfaces while avoiding clogging issues.
Implementation Method 1
The at least one through hole is made in a condition in which the first and the second heat exchanger plates have been joined to each other. The at least one through hole may be made by a thermal process using a laser beam process, an electron beam process or a plasma process.
Implementation Method 2
The at least one through hole is made in a condition in which the first and the second heat exchanger plates have been joined to each other. The at least one through hole may be made by a thermal process using a laser beam process, an electron beam process or a plasma process.
Implementation Method 3
The at least one through hole is made in a condition in which the first and the second heat exchanger plates have been joined to each other. The at least one through hole may be made by a thermal process using a laser beam process, an electron beam process or a plasma process.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
A plate package (P) including a number of first heat exchanger plates (A) and a number of second heat exchanger plates (B). Each heat exchanger plate (A, B) has a first porthole (8), surrounded by a peripheral rim (20). The first heat exchanger plates (A) and the second heat exchanger plates (B), are joined to each other and arranged side by side in such a way that the peripheral rims(20) together define an inlet channel (9) extending through the plate package (P). The peripheral rim (20) of the first and/or the second heat exchanger plates (A, B) has at least one through hole (25), forming a fluid passage (26) allowing a communication between the inlet channel (9) and the first plate interspaces (3). The at least one through hole (25) is made in a condition in which the first and the second heat exchanger plates (A, B) have been joined to each other to form the plate package (P). The invention also relates to a method of providing such plate package, a plate heat exchanger using such plate package and the use of a thermal hole making process using a laser process, an electron beam process or a plasma process to make such plate package.