Compact Plate Processing System Merging Laser and Punch Press
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Solution Overview
Problem
Existing plate processing systems that combine punch press and laser machines are inefficient due to the need for large installation spaces and high displacement of workpieces during processing, limiting the utilization of high-speed cutting capabilities and accuracy.
Innovation Solution
A compact plate processing system that includes a moving laser head and a processing tool capable of intersecting the transfer direction of the workpiece, utilizing a fork device and transfer device to support and position the workpiece accurately, allowing for high-speed processing and reduced system size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate punch press machine and laser machine are used, then processing functions are complete, but installation space becomes large and workpiece transfer time increases
Solution Approach 1:
The patent combines the laser machine and punch press machine into a single integrated processing system. The laser head and punch press tool are mounted on the same moving carriage, allowing both processing functions to be performed in one compact machine, thereby reducing installation space while maintaining complete processing capabilities.
Solution Approach 2:
The moving carriage is designed to accommodate multiple processing tools including both the laser head and punch press tool. This universal platform allows the same mechanical structure to perform different processing functions, eliminating the need for separate dedicated machines and reducing overall system footprint.
2Adaptability or versatility
If workpiece is moved between separate machines, then processing is complete, but workpiece displacement occurs reducing accuracy
Solution Approach 1:
By integrating both laser processing and punch press operations into a single machine with a common moving carriage, the workpiece remains stationary on the table throughout both operations. This eliminates the need to transfer the workpiece between separate machines, thereby preventing positioning errors and maintaining high manufacturing precision.
3Ease of operation
If workpiece is moved with respect to fixed laser head, then processing is possible, but high-speed cutting advantage cannot be utilized
Solution Approach 1:
Instead of moving the workpiece under a fixed laser head, the patent inverts the approach by keeping the laser head mounted on a moving carriage that travels across the stationary workpiece. This allows the laser to maintain optimal positioning and utilization of high-speed cutting capabilities while processing different areas of the workpiece.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient and accurate processing of workpieces by stabilizing the workpiece during transfer and positioning, allowing for high-speed cutting and forming operations while minimizing system size and displacement issues.
Implementation Method 1
a first processing device (10) including a laser head (11) that moves relatively with respect to a plate-shaped workpiece (W) disposed in a first processing region (10R) to process the workpiece (W)
Implementation Method 2
a second processing device (30) including a processing tool (32) that moves in a direction intersecting a transfer direction of the workpiece (W) in a second processing region (30R) and processes the workpiece (W)
Data Source
AI summary
A compact system that accurately process a workpiece includes a first processing device including a laser head that moves with respect to a plate-shaped workpiece in a first processing region to process the workpiece, a fork device that supports the workpiece in the first processing region, a transfer device that holds and transfers the workpiece supported by the fork device, and a second processing device including a processing tool that moves in a direction intersecting a transfer direction of the workpiece in a second processing region and processes the workpiece, the second processing region being located in a portion of a transfer path of the workpiece transferred by the transfer device.


