Plate Sealing With Pressure-Controlled Gap Uniformity
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Solution Overview
Problem
The existing methods for sealing electronic components, such as photovoltaic panels or display components, face challenges in achieving uniform and narrow intermediate spaces with consistent layer thicknesses, particularly below 100 micrometers, due to the waviness of float glass and the inefficiency of gravity-dependent deformation processes.
Innovation Solution
A method involving the creation of a pressure difference between the intermediate space and the outer space, using a fusible solder material, where the external pressure is higher than the internal pressure, and the temperature of the solder is temporarily raised above its melting point to control the deformation of the plates, allowing for precise adjustment of the gap distance between the plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If glass plates with waviness are sealed using gravity-dependent deformation at high temperatures, then the intermediate space can be reduced, but the process time becomes relatively high and the uniformity of the intermediate space is insufficient
Solution Approach 1:
The patent replaces the gravity-dependent mechanical deformation system with a pressure-controlled system. By applying external pressure through a pressure difference between the intermediate space and outer space, the deformation process is accelerated and better controlled, reducing process time while achieving uniform thin intermediate spaces of less than 100 micrometers.
Solution Approach 2:
The patent changes the physical parameters of the system by controlling pressure difference and temperature. By temporarily raising the temperature above the melting point of the solder material while maintaining a pressure difference, the method achieves rapid and uniform deformation of the intermediate space without requiring prolonged heating times.
2Volume of moving object
If the temperature is raised above the softening temperature of glass plates to achieve deformation, then the intermediate space can be reduced, but the mechanical properties of safety glass may be compromised
Solution Approach 1:
The patent carefully controls the temperature parameter to remain below the softening temperature of safety glass (350°C) while temporarily raising it above the melting point of the solder material. This selective temperature control allows the solder to become fluid for sealing while the glass plates maintain their mechanical strength and structural integrity.
3Manufacturing precision
If a uniform intermediate space with thickness below 100 micrometers is produced, then the sealing precision is improved, but the process complexity increases due to the need for pressure difference control
Solution Approach 1:
The patent replaces complex mechanical positioning and support systems with a pressure difference control system. By applying uniform pressure across the intermediate space, the method achieves superior uniformity in thin space thickness without requiring complex mechanical fixtures or positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the time required to achieve the desired deformation, enables the production of uniform intermediate spaces with dimensions as low as 5 to 100 micrometers, and maintains the mechanical properties of safety glass by keeping the temperature below 350°C, ensuring a stable and fluid-tight seal.
Implementation Method 1
the temperature of the solder material is temporarily raised above its melting temperature or processing temperature
Implementation Method 2
By creating a pressure difference, large forces can be generated which can lead to a reduction in the intermediate space between the plates
Implementation Method 3
the glass panes soften so that, due to the effect of the gravitational force, the respective upper pane rests on the lower pane
Data Source
AI summary
The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3′) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3′) is at least temporarily raised above its melting temperature during the existence of the pressure difference.