Plate-Shaped Pressure Detection Module for Compact Sensor Design
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Solution Overview
Problem
Existing pressure sensor devices require a large structural volume and complex manufacturing to maintain a reference vacuum for low-measuring tolerance pressure detection, leading to high costs and complexity due to the need for hermetically sealed contact elements.
Innovation Solution
A pressure detection module with a plate-shaped receptacle part and a carrier substrate that allows for hermetically sealed fixing and reduced installation space, enabling cost-effective manufacturing and modular calibration, using a flange for sealed attachment and ceramic substrates for media resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If hermetically sealed contact elements are used to maintain reference vacuum for low measuring tolerance pressure detection, then measurement precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the hermetic sealing function from the contact elements themselves and relocates it to the carrier substrate. The carrier substrate acts as a hermetic barrier that isolates the reference vacuum chamber from the external environment, while contact elements can now penetrate through the carrier substrate without compromising the seal. This resolves the contradiction by eliminating the need for complex hermetically sealed contact elements while maintaining measurement precision.
Solution Approach 2:
The carrier substrate serves as an intermediary component that mediates between the reference vacuum chamber and the external environment. It provides both mechanical support and hermetic sealing, allowing electrical signals to be conducted outward while maintaining the vacuum seal. This intermediary structure enables simple contact element design while preserving measurement accuracy.
2Measurement precision
If hermetically sealed contact elements are used to maintain reference vacuum, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the hermetic sealing function from the contact elements and assigns it to the carrier substrate. This allows contact elements to be simple, inexpensive components that can be easily manufactured and replaced, while the carrier substrate handles the complex hermetic sealing requirement. This significantly reduces manufacturing cost while maintaining measurement precision.
Solution Approach 2:
By separating the hermetic sealing function from the contact elements, the contact elements can be made as simple, inexpensive components. If a contact element fails, it can be replaced without replacing the entire sensor device, reducing overall manufacturing and maintenance costs while maintaining measurement precision.
3Measurement precision
If a reference vacuum is maintained in the housing for low measuring tolerance pressure detection, then measurement precision is improved, but device complexity increases due to hermetic sealing requirements
Solution Approach 1:
The patent extracts the hermetic sealing function from the housing and contact elements and concentrates it in the carrier substrate. This single location approach simplifies manufacturing by focusing the sealing requirement on one component rather than requiring multiple hermetic joints throughout the housing assembly. The reference vacuum is maintained with simpler construction, reducing manufacturing complexity while preserving measurement precision.
Solution Approach 2:
The patent merges the mechanical support function and hermetic sealing function into the carrier substrate. This consolidation eliminates the need for separate sealing mechanisms and simplifies the overall device structure, reducing manufacturing complexity while maintaining the reference vacuum for precise measurements.
Data Source
AI summary
A pressure detection module of a pressure sensor device includes a receptacle part for receiving a carrier substrate. The carrier substrate is located on a first side with a pressure detection unit, and is inserted into the receptacle part with a second side facing away from the first side. The carrier substrate is fixed with its second side on a base of a receptacle groove. In order to construct the pressure detection module as small as possible, and to manufacture it in a cost-effective way, the receptacle part, the receptacle groove and a peripheral flange around the receptacle groove are, for example, provided with a plate-shaped design. The base has a contacting opening, through which contact surfaces of the carrier substrate, which are exposed at the contacting opening, are electrically contactable.