Plate-Shaped Solder Forming by Crimped Thread Aggregation
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Solution Overview
Problem
The high cost and complexity of managing ribbon solder materials in semiconductor module manufacturing, particularly due to their expense and the need for specific widths and thicknesses, lead to increased manufacturing costs and inventory management challenges.
Innovation Solution
A method and device for manufacturing a plate-shaped solder by aggregating and crimping multiple thread solders to form a plate-shaped solder, allowing for easy adjustment of shape and reducing the need for multiple types of solder materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ribbon solder is used as solder material, then bonding stability and reliability are improved, but manufacturing cost increases and inventory management becomes complicated
Solution Approach 1:
The invention segments the ribbon solder into multiple thread solders that are aggregated together. Instead of using a single ribbon solder with specific width and thickness requirements, the invention uses several thinner thread solders (e.g., five thread solders) that are bundled and crimped together to form an aggregated solder structure. This segmentation allows the system to maintain the bonding reliability of ribbon solder while using simpler, more manageable thread solder components that reduce inventory complexity.
2Manufacturing precision
If ribbon solder with specific width and thickness is used, then mounting precision is improved, but the number of solder types to be managed increases
Solution Approach 1:
The invention creates a universal aggregated solder structure that can serve multiple mounting precision requirements. By aggregating a standard number of thread solders (e.g., five thread solders with 0.5mm diameter) and crimping them together, the system creates a multi-functional solder unit that can replace various ribbon solder specifications. This universal aggregated structure maintains the necessary mounting precision while eliminating the need to manage multiple different ribbon solder types.
3Adaptability or versatility
If thread solder is aggregated to form plate-shaped solder, then manufacturing cost is reduced and adaptability is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The invention merges multiple simple thread solder manufacturing processes into a unified aggregated solder production system. Instead of manufacturing different ribbon solder specifications through complex rolling and shaping processes, the invention combines multiple standard thread solders through aggregation and crimping. This merging approach reduces the overall manufacturing process complexity by using a standardized thread solder production method that can be adapted to create various plate-shaped solder configurations by simply changing the number of thread solders aggregated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, simplifies inventory management, and prevents mistakes in solder material mounting by allowing for customizable solder shapes and thicknesses, while minimizing unnecessary material usage.
Implementation Method 1
a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder
Data Source
AI summary
A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.