Plate Solder Forming from Thread Solder for Flexible Dimensions
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Solution Overview
Problem
The high cost and complex management of ribbon solder materials in semiconductor module manufacturing, particularly due to their expense and the need for various widths and thicknesses, make existing methods inefficient and prone to errors.
Innovation Solution
A device and method for manufacturing plate solder by cutting, aggregating, and pressure bonding thread solder into a plate form, allowing for adjustable width and thickness, using a reel, cutter, aggregating part, and roller to form a plate solder with a housing part, press unit, and thickness adjusting mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ribbon solder is used for chip mounting, then joining stability and reliability are improved, but production cost increases and material management becomes complex
Solution Approach 1:
The invention segments the ribbon solder into multiple thread solders that are aggregated and pressure-bonded together. This allows the use of standard thread solder materials instead of custom ribbon solder, simplifying material management while maintaining joining reliability through the aggregated structure
Solution Approach 2:
The invention uses inexpensive thread solder instead of expensive ribbon solder. By aggregating multiple thread solders and pressure-bonding them, the system achieves reliable joining performance at lower material cost and with simpler, more standardized components
2Reliability
If ribbon solder is used, then chip mounting reliability is improved, but production cost increases
Solution Approach 1:
The ribbon solder is segmented into multiple thread solders that are then aggregated and pressure-bonded. This segmentation allows the use of standard, inexpensive thread solder materials while achieving the mechanical properties needed for reliable chip mounting
Solution Approach 2:
The invention creates a composite structure by aggregating and pressure-bonding multiple thread solders together. This composite approach achieves the desired mechanical strength and reliability equivalent to ribbon solder, but using cheaper base materials
3Manufacturing precision
If multiple kinds of ribbon solder are managed for different widths and thicknesses, then manufacturing precision is improved, but device complexity and stock management increase
Solution Approach 1:
The invention enables dynamic adjustment of plate solder dimensions by controlling the aggregation and pressure-bonding process. Instead of managing multiple pre-made ribbon solder types, the system can produce various widths and thicknesses on-demand from standard thread solder, reducing inventory complexity
Solution Approach 2:
The aggregation and pressure-bonding device serves multiple functions: it can produce plate solders of various widths and thicknesses from a single thread solder material. This universal approach replaces the need for multiple specialized ribbon solder types, simplifying material management while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy adjustment of plate solder dimensions, reducing production costs by utilizing less expensive thread solder and simplifying material management, as the method allows for continuous production of plate solders with specified dimensions without the need for multiple ribbon solder types.
Implementation Method 1
a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder
Data Source
AI summary
A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.