Plated Ceramic Plate With Low Hydrogen Desorption for Void-Free Soldering
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Solution Overview
Problem
Ceramic plates with plating films on their surfaces often fail to form adequate connections with electronic components via soldering due to the formation of voids caused by hydrogen release from the plating film during the soldering process.
Innovation Solution
The ceramic plates are designed with specific hydrogen release criteria, where the release amount at 250°C is 5.0 × 10 -10< A/g or less, and the ratio of release amounts at 250°C and 300°C is 0.3 or less, using an electroless plating film containing nickel or copper, and are manufactured through high-pressure forging and heating processes to minimize hydrogen incorporation in solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a plating film is applied to the ceramic plate surface to improve solder wettability, then connection ease is improved, but hydrogen release during heating causes void formation and connection reliability deteriorates
Solution Approach 1:
The patent applies parameter changes by严格控制 the hydrogen release amount of the plating film at specific temperature points (A250 ≤ 5.0 × 10^-10 A/g at 250°C and A250/A300 ≤ 0.3). This quantitative control of hydrogen release parameters resolves the contradiction by selecting plating films with optimized composition and thickness that provide good solder wettability while minimizing hydrogen evolution during the soldering process, thus preventing void formation and ensuring reliable connections.
2Manufacturing precision
If high-pressure forging is used to manufacture the ceramic plate to improve manufacturing precision, then density and structural integrity are improved, but hydrogen incorporation into the material increases
Solution Approach 1:
The patent applies preliminary action by performing a debinding treatment at 400-600°C for 1-24 hours after the high-pressure forging process. This preliminary thermal treatment removes hydrogen and other volatile substances incorporated during forging before the plating film is applied and before final assembly. By addressing hydrogen removal in advance, the method prevents hydrogen from causing voids during subsequent soldering, thus resolving the contradiction between achieving high density through forging and preventing hydrogen incorporation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic plates achieve reliable solder connections with electronic components by reducing void formation, enhancing bondability and connectivity.
Implementation Method 1
when the ceramic plate is heated from 25°C to 400°C at a temperature rising rate of 5 °C/min according to a temperature-programmed desorption gas analysis method, a release amount A250 of hydrogen per unit mass of the ceramic plate at 250°C is 5.0 × 10^-10
Data Source
Figure 1~2
Figure 3(a)~3(c)
AI summary
There is provided a ceramic plate including a plating film on at least a part of a surface of a plate-like ceramic member. When the ceramic plate is heated from 25°C to 400°C at a temperature rising rate of 5 °C/min according to a temperature-programmed desorption gas analysis method, a release amount A250 of hydrogen per unit mass of the ceramic plate at 250°C is 5.0 × 10-10 A/g or less in terms of a mass spectral intensity based on an ion current value.