Plated Coil Pattern Rectangular Shape Inductance
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Solution Overview
Problem
Conventional coil patterns formed through plating processes have limitations in achieving optimal inductance and resistance due to their round shape, which restricts the ratio of the upper surface width to the lower surface width, leading to increased resistance and decreased inductance.
Innovation Solution
A coil pattern is formed with a spiral shape on a substrate, featuring a first plating film with a gradually decreasing width from the lower surface to the upper surface, and a second plating film covering the first film, resulting in vertical side surfaces and small rounded upper corners, thereby approximating a rectangular shape, allowing for increased inductance and reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a coil pattern is formed through a conventional plating process, then the manufacturing process is simple, but the edges between upper and side surfaces become rounded, resulting in increased resistance and decreased inductance
Solution Approach 1:
The coil pattern formation process is segmented into multiple plating stages: a first plating process forms an initial coil pattern, followed by a second plating process that deposits additional material to create vertical side surfaces. This segmentation allows each plating stage to be optimized independently, achieving both manufacturing simplicity and shape precision.
Solution Approach 2:
The first plating process performs a preliminary action by forming a base coil pattern with controlled dimensions before the second plating process. This preliminary structure serves as a foundation that, when combined with the second plating, achieves the target rectangular shape with vertical sides, resolving the shape precision issue while maintaining process simplicity.
2Reliability
If the height of the coil pattern is increased to maintain inductance, then the cross-sectional area increases, but the width of the upper surface decreases due to rounding, leading to increased resistance
Solution Approach 1:
The invention intentionally introduces controlled curvature through the second plating process, where the plating solution deposits material at a rate that creates convex curved surfaces. This controlled curvature compensates for the rounding effect, maintaining vertical side surfaces and preserving the upper surface width, thereby reducing resistance while allowing height increase for maintained inductance.
3Loss of energy
If the coil pattern is formed with a higher ratio of upper surface width to lower surface width, then resistance decreases, but achieving this ratio becomes more difficult with conventional plating methods
Solution Approach 1:
The invention changes key parameters of the plating process, including solution composition, temperature, current density, and deposition time, to control the plating rate. By optimizing these parameters across two plating stages, the process achieves a high upper-to-lower surface width ratio (reducing resistance) without requiring overly complex process equipment or procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described coil pattern achieves a resistance value within 101% to 110% of the ideal rectangular shape, enhancing inductance while maintaining a more rectangular shape than typical plating processes, thus improving electrical characteristics.
Implementation Method 1
a first plating film formed on the substrate
Implementation Method 2
a second plating film formed to cover the first plating film
Data Source
AI summary
Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.