Plated Coil Component Structure for Filling Resin Wall Step Portions
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Solution Overview
Problem
In coil components, the step portion between the pedestal and wall portions of resin walls often experiences insufficient plating growth, leading to deteriorated characteristics due to incomplete filling with coil conductors.
Innovation Solution
The coil component design ensures that the height ratio of the pedestal portion to the seed portion (0.3≤h1/h2≤10) facilitates close proximity of the plating start position to the step portion, allowing for effective filling of the step portion with coil conductors, and uses the same resin material for both pedestal and wall portions to enhance plating growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wall portion is made narrower than the pedestal portion to increase coil conductors, then coil characteristics are improved, but plating growth becomes difficult in the step portion and characteristics deteriorate
Solution Approach 1:
The patent controls the height ratio of the pedestal portion relative to the seed portion (h1/h2) within a specific range (0.3≤h1/h2≤10). This parameter optimization ensures that the step portion height is appropriate, allowing plating solution to effectively reach and fill the step portion while maintaining the narrow wall portion design that increases coil conductor amount.
Solution Approach 2:
The pedestal portion is designed with sufficient height before plating occurs, creating a preliminary structure that facilitates proper plating growth. The pre-formed pedestal portion ensures that when plating occurs, the step portion is at an optimal height for effective plating solution penetration and conductor filling.
2Manufacturing precision
If the pedestal portion height is increased to facilitate plating growth, then plating growth is improved, but the amount of coil conductors between wall portions decreases
Solution Approach 1:
The patent establishes an upper bound for the pedestal portion height relative to the seed portion height (h1/h2≤10). This prevents the pedestal portion from being too tall, which would reduce the space available for coil conductors between the wall portions, while still maintaining enough height to facilitate proper plating growth in the step portion.
3Adaptability or versatility
If different resin materials are used for pedestal and wall portions, then manufacturing flexibility is increased, but plating growth is hindered in the step portion
Solution Approach 1:
The patent specifies that the same resin material is used for both the pedestal portion and the wall portion. This material homogeneity ensures consistent surface properties throughout the resin structure, facilitating uniform and effective plating growth across the step portion without the complications that would arise from material transitions or interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design suppresses the deterioration of coil characteristics by ensuring the step portion is filled with coil conductors, improving the coil's performance and reducing direct current resistance.
Implementation Method 1
a coil having a seed portion provided on a main surface of the substrate and a plating portion covering the seed portion
Data Source
AI summary
In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3≤h1/h2≤10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.