Plated Magnetic Body Electrodes for Inductor Contact Reliability
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Solution Overview
Problem
Existing inductor manufacturing methods face issues with contact defects between the internal coil part and external electrodes, leading to increased contact resistance and manufacturing costs, while also limiting the volume of the magnetic body, which affects inductance and efficiency.
Innovation Solution
The electronic component features external electrodes formed directly on the magnetic body through plating, using magnetic metal powder, which eliminates the need for conductive resin paste, allowing for precise thickness control and reducing manufacturing costs, and includes multiple plating layers for improved connectivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive resin paste is used to form external electrodes, then manufacturing process is simplified, but contact defects occur and contact resistance increases
Solution Approach 1:
The patent introduces a plating layer as an intermediary between the magnetic body and the external electrode. This plating layer serves as a mediator that ensures reliable electrical contact while eliminating the contact defects associated with direct conductive resin paste application. The plating layer acts as a buffer that improves adhesion and reduces contact resistance.
Solution Approach 2:
The patent replaces the mechanical/conductive resin paste-based electrode formation with an electrochemical plating process. By substituting the resin paste application method with electroplating, the invention achieves more reliable electrical contact and eliminates the contact defects that plague the traditional method.
2Reliability
If magnetic body volume is increased to improve inductance, then inductance and efficiency improve, but manufacturing cost increases
Solution Approach 1:
The patent optimizes the plating layer thickness and composition parameters to achieve the desired electrical performance without requiring excessive magnetic body volume. By carefully controlling plating parameters such as thickness, material composition, and deposition conditions, the invention reduces material costs while maintaining high inductance performance.
3Reliability
If external electrodes are formed with multiple plating layers, then connectivity and adhesion improve, but manufacturing complexity increases
Solution Approach 1:
The patent divides the external electrode into multiple functional plating layers, each with specific properties. The first plating layer provides adhesion to the magnetic body, while the second plating layer provides electrical conductivity and solderability. This segmentation of functions into distinct layers improves overall reliability while keeping each individual layer relatively simple.
Solution Approach 2:
The patent uses composite plating structures combining different materials with complementary properties. The multi-layer plating system combines materials optimized for adhesion with materials optimized for conductivity, creating a composite electrode structure that achieves superior performance without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents contact defects, enhances inductance and DC-bias characteristics, improves efficiency, and decreases manufacturing costs by eliminating the use of costly conductive resin paste and allowing for a larger magnetic body volume.
Implementation Method 1
the external electrodes include first plating layers formed to directly contact the magnetic body
Data Source
AI summary
An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.